Electronics Forum: csp (Page 26 of 34)

PCB Gold Plating

Electronics Forum | Fri Feb 09 20:05:15 EST 2001 | benefid

The ENIG process will yield between 3-7 micro inches (110 - 275 microns) of gold over the nickel barrier. This thickness range is pretty much the limit as this is a self limiting displacement reaction process. Once all surface nickel ions are repl

help our school

Electronics Forum | Fri Jun 01 13:10:23 EDT 2001 | caldon

Be current.......Is my best suggestion. Electronics Theory and three stage audio amplifiers are great for class room environment but does not 100% apply in manufacturing. Teach through hole and SMT related classes. teach manufacturing. There are tons

solder land analisys

Electronics Forum | Thu Jul 15 11:57:15 EDT 1999 | nards penalosa

We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwell

Re: solder land analisys

Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon

| We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe

Re: solder land analisys

Electronics Forum | Thu Jul 15 15:55:41 EDT 1999 | nards penalosa

| | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec d

Re: BGA rework : IR or convection

Electronics Forum | Tue May 11 12:02:03 EDT 1999 | Tony

| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, I have been doing BGA rework for

Any SMTnetters coming to the Chip scale and BGA National Symposium?

Electronics Forum | Thu Apr 29 17:33:30 EDT 1999 | Steve Gregory

Just curious, Are any of ya'll coming out here to the Chip scale and BGA National Symposium out here in Santa Clara, Cal-i-for-ni-yay next week? I'm a-goin'...gonna learn more about them little buggers...I just know enough now to be extremely dange

Re: Any SMTnetters coming to the Chip scale and BGA National Symposium?

Electronics Forum | Thu Apr 29 17:40:40 EDT 1999 | JohnW

| Just curious, | | Are any of ya'll coming out here to the Chip scale and BGA National Symposium out here in Santa Clara, Cal-i-for-ni-yay next week? I'm a-goin'...gonna learn more about them little buggers...I just know enough now to be extremely

Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 09:36:35 EST 1999 | Parvez Patel

Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concerns fo

Re: QUAD / MYDATA / CONTACT SYSTEMS

Electronics Forum | Wed Oct 28 18:02:06 EST 1998 | Jeff Kline

| Does anyone have info on any of these systems (good or bad). We are looking at these 3 types for a new SMT pnp machine. We are low volume high mix. | | Thanks, Dave | I may be able to supply you with some valuable info on all three manufacture


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