Electronics Forum | Sun Jan 06 22:14:57 EST 2008 | mac88
If the machine or machines couldn't recognize the fiducials, you can grind it with a fiberglass eraser. If the fiducial are missing you can use tooling holes, and/or via holes. You can verify the hole size and tolerance on the PCB assembly drawing.
Electronics Forum | Wed Dec 19 15:12:25 EST 2007 | slthomas
I see. You might request that those parts be provided in the proper trays (125�) for starters, but I do understand the issues with contract assembly. I'd be inclined to write a program to pick them from that tray and place them into a proper one. Wh
Electronics Forum | Thu Jan 03 10:21:06 EST 2008 | fsw
Hi all! Heres wishing everyone a Happy & Prosperous 2008!! We are a small OEM/CM that use Ni tabs in our design/applications. We have a request to use Stainless steel to reduce/eliminate the Ni content. Can Stainless steel be soldered? If yes, is ou
Electronics Forum | Thu Jan 03 17:39:34 EST 2008 | flipit
Why are you using stainless steel? Corrosion resistance? Can the stainless be gold plated? I think this can occur metallurgically. Maybe nickel first then gold. Why are you removing the nickel? Nickel is somewhat magnetic. Had an application onc
Electronics Forum | Tue Jan 08 18:24:32 EST 2008 | jmelson
If your wedding ring ever gets hot enough to melt solder, I sure hope your finger isn't in it at the time! On the original question, most stainless alloys have quite a bit of Nickel in them, so going to stainless will not ELIMINATE nickel, although
Electronics Forum | Tue Jan 15 13:16:25 EST 2008 | ck_the_flip
Yes, the previous "non-balling" flux was alcohol based, but very weak activity. We found it was worth the switch to water-based, to get prettier solder joints - but...at the expense of having to "brush off" solder balls on a couple of assemblies wit
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Thu Nov 20 13:00:36 EST 2008 | jameskelch
Calling out materials by name locks you into laminates by brand. If these are typically phenolic materials it can lead to moisture absorption, less mechanical strength and more prone to delamination during assembly. It is more effective to refer
Electronics Forum | Mon Feb 18 08:56:44 EST 2008 | operator
It does exist. We used to have one here, but sold it. It was more of a manual process though. You put the assembled board on the work table and then set your cutting blade height. Then you manually moved the cutting blade around shearing off the TH l
Electronics Forum | Mon Feb 25 15:43:09 EST 2008 | schorschimi
the information on "slide lines" in this forum sounds fine, but if you have to stuff 10 boards with 100 or more components a slide line is not very practical. We therefore have 1 worker do the whole board. I assume that others face the same task. Wh
