Electronics Forum: handle (Page 27 of 200)

Flex Circuits reflowing

Electronics Forum | Thu May 01 15:22:39 EDT 2003 | Chris

Are there any guidelines when building products with flex circuits? Any heat profile guidelines? Wash Guidelines? Handling Guidelines. Is it best to run on the same line?

15.7 mil QFP

Electronics Forum | Mon Jun 02 09:38:12 EDT 2003 | pjc

yo Evt, ".., what's the difference?". Answer: Huuuge!! between running 0.4mm pitch QFP and a BGA of same I/O, in terms of handling, storage, feeding (trays), p&p, inspection, test, rework, etc.......

Cracks on ceramic capacitors.

Electronics Forum | Tue Jul 01 11:15:43 EDT 2003 | PH

Are these caps on the bottom side or topside? Bottomside could be the glue dots are too big for the caps your putting down, the glue cures and then the solder is putting force on the edges of the cap causing cracks.. Other than that agree with oth

CRTech/ Photon Dynamics & Support

Electronics Forum | Sun Aug 17 21:09:48 EDT 2003 | fastek

George- Send me an e-mail and I will put you in touch with the group that is handling service for CR Tech/Photon Dynamics. Rick fastek@attbi.com

Fuji Flexa

Electronics Forum | Wed Oct 15 14:59:04 EDT 2003 | William Guatemala

I strongly reconmend to switch over to Flexa. It's much easier and reliable than FujiCam and UniCam. Except the PCB's have to be very roboust to handle all the security fixtures. W. G

Reflowed Component Placement Tolerance

Electronics Forum | Wed Oct 15 16:15:24 EDT 2003 | russ

A good pad design along with a capable placement machine should handle this easily. 16mil pitch components need placement accuracy to about .002" so this shouldn't be a big problem to achieve. This placement tolerance is also basically the same as

Used equipment sales

Electronics Forum | Fri Oct 24 15:45:05 EDT 2003 | adlsmt

If your boards are 18"X18", what size magazines are you using? Most unloaders only handle 18"x18" magazines. If thats what you want I have Panasonic and Fuji unloaders for $2,000.00/ea I am an end user not a broker.

Selective BGA ball removal

Electronics Forum | Fri Nov 07 16:00:45 EST 2003 | Don A

It would depend on how many boards and parts you need to build. I would prefer an etch cut as it leaves the the part intact and you get the strength of the solder joint. It also reduces the handling of the BGA and associated damage from that

CAD import tool for Sanyo TCM or Universal HSP

Electronics Forum | Mon Dec 08 05:05:18 EST 2003 | wurzlseppl

I�m looking for a cad import tool for the Sanyo TCM 1100 or Universal HSP 4790/91/92. Does anyone have a tool, or how do you handle thze cad import? Thank you

Stencil Storage

Electronics Forum | Tue Mar 02 17:08:17 EST 2004 | dgjjr

We also use IIT. I evaluated the skin guard treatment a few months back. It definately cleaned up the edge but not enough to make much difference if you mis-handle a bare stencil.


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