Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika
Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t
Electronics Forum | Mon Jun 30 08:32:16 EDT 2008 | grics
Earlier this month our organization began researching how turn our facility into a paperless manufacturing floor. The scope ended up widening into a much larger project. During our research we found 2 software companies so far that are pretty impre
Electronics Forum | Tue Jul 22 08:26:03 EDT 2008 | mmjm_1099
I would suggest calling Fuji and they can do a webex with you. But, if you wish to figure it out yourself here you go. 1.) Go into the program you wish to change. 2.) CP43 machine configuration 3.) Pick which holder you wish to change and a drop dow
Electronics Forum | Fri Aug 08 11:37:09 EDT 2008 | pjc
Yes, sure. In fact in some applications ICT is coming back. Mainly due to the fact that more and more SMT discrete components have no markings, so AOI cannot tell you if you have the correct value on the PCB. Fixed pin or flying probe ICT is a valuab
Electronics Forum | Tue Sep 02 15:35:55 EDT 2008 | modernprecison
I have a Siemens S-27 and I'm having occasional issues with 0201 components in particular. I'm using the 12 segment head and 902 nozzles with them. I'm making sure the magnet is clean of debris and the feeder is sitting flat. Most of the time they
Electronics Forum | Mon Jan 12 12:43:34 EST 2009 | smt_guy
With the High Volume Manufacturing in United States became lesser and the current crisis that the country is dwelling in, Low to Medium Volume - High Mix Manufacturing is very common and small EMS Providers are scrambling to get a Pie of the Job. I
Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep
We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f
Electronics Forum | Fri Jun 05 00:09:31 EDT 2009 | operator
I have been trying to get in touch with TI about their SMT RFID chips. I want to learn more about its capabilities and everything involved. I have read many articles on RFID in general, but finding specific info on the SMT application has been diffic
Electronics Forum | Tue Aug 18 17:49:16 EDT 2009 | dyoungquist
Is there a limit to how many times a pcb with components can be run through a reflow oven before the components start to degrade? Example: We load the SMT components on the bottom side of the pcb and run it through the reflow oven. Next we load the
Electronics Forum | Fri Sep 25 08:09:46 EDT 2009 | markhoch
DudeBro, who peed in your oatmeal this morning? Relax, it's all good. Your anger is what me find it so funny. Excuse me for chiming in. I could've helped, but saw that he already had the information that he needed. As far as my inexperience goes..I'v
