Electronics Forum: see (Page 263 of 725)

Solderability issues due to excessive nickel

Electronics Forum | Mon Oct 27 20:01:00 EDT 2014 | rangarajd

Hello, We are facing solderability issues on a particular lot of board. THe Nickel thickness measured with an XRF is around 400 U inches. Spec calls out for 130 u inches Nickel and 3 - 5 U inches gold over it. Assuming there is no porosity on the g

I am looking for an IPC spec for intentional PCB warp

Electronics Forum | Tue Dec 23 08:31:34 EST 2014 | proceng1

I know the contract rules, but this is idiotic. I did find the 10.2.6 spec already, but I had not looked at the TM-650. I'll check that out, thanks. I also may have found another part that has a better clearance, so I also hope to use these specs

stencil/printing machines for solder paste

Electronics Forum | Wed Jul 08 03:43:27 EDT 2015 | pmcg

I'd also be interested in seeing what the OP went for too. We're thinking of upgrading our MPM3000 series. Has served us well over the years but is a bit dated to say the least. Not heard much about the SJ Inno. machines here in the UK. Would prob

PCB profiling

Electronics Forum | Fri Feb 13 10:10:21 EST 2015 | rgduval

I'm with Evtimov...if you've got a new assembly with a BGA (and especially if BGAs aren't an every day occurrence in your process) it should definitely be profiled. I have run BGA boards without profiling before, and got lucky...but, I wouldn't reco

PCBA Id using Laser marking

Electronics Forum | Wed Mar 04 22:24:28 EST 2015 | SKR

We are using Nutek NTM4910-XL laser marker to etch 2D barcode on all our boards. We added solid silkscreen box on all our boards to create contrast. When we laser etch them, we just burn the silkscreen box so that we can see the soldermask under it c

DQFN INSUFFICIENT SOLDER / HEAD ON PILLOW

Electronics Forum | Fri Mar 06 10:11:02 EST 2015 | eezday

Hello Adriano, I see that you have ran several test with differnt valumes of solder paste which is a reasonable path. Have you run any solderability tests? Head in pillow is usually considered a solderability problem. Also, what type of plating a

DQFN INSUFFICIENT SOLDER / HEAD ON PILLOW

Electronics Forum | Fri Mar 06 12:02:45 EST 2015 | emeto

Hello, I see you checked your options in stencil design, but did you check the pad design on the board itself? May be the board has to be fixed. We run some dual row QFNs and never had a problem. I would examine the pad design and the finish of the

Flux wave on PCBs

Electronics Forum | Sat Mar 14 15:48:40 EDT 2015 | horchak

The white haze is definitely an indication of moisture being trapped in uncured or improperly applied solder mask. You can verify this by heating up the board using a heat gun on an area of the board with the white haze, and if it clears up that is t

smt costings

Electronics Forum | Wed Apr 01 08:23:05 EDT 2015 | emeto

All you have to do is to go on the floor when the machines are running and see yourself what the speed is. All machines show this data and even more. Most machines show some statistical data too - you can dig a little bit into that and you will get y

Conceptronic Reflow Oven help needed

Electronics Forum | Sat Apr 25 11:37:56 EDT 2015 | ercdave1

DucHoang, thank you for your reply. as you mentioned I checked the solid state relays on the input and output side. I did get power coming out of all even when the conveyor was stopped. I will mark them with their position and swap some to see what h


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