Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Sat Feb 14 13:35:43 EST 1998 | ashok dhawan
| I'm in the process of running a no-clean paste evaluation. I'm presently writing the | specifications for the laboratory test requirements (SIR testing, flux testing, etc.). | So far, I've developed a very comprehensive set of test criteria usi
Electronics Forum | Wed Jan 14 08:16:13 EST 1998 | Allison
I gleen from your post that this assembly is mixed technology. You may have a compatibility problem between the flux in your wave solder machine and the flux in your solder paste. Check with the manufacturer of each and see if they interact. | I ha
Electronics Forum | Thu Jan 15 15:15:25 EST 1998 | justin
| I gleen from your post that this assembly is mixed technology. You may have a compatibility problem between the flux in your wave solder machine and the flux in your solder paste. Check with the manufacturer of each and see if they interact. | |
Electronics Forum | Tue Sep 25 14:38:05 EDT 2001 | nwyatt
1. SRT has been recently calibrated - problem is too many hands in the machine and careless mistakes. The profile is good and has been recently checked by a fellow from Genrad. 2. We are relying on the left over solder from the previous joint and
Electronics Forum | Thu Sep 27 16:11:38 EDT 2001 | flipchip
Monkey, I have read all the replies you received. I have extensive experience in reworking these parts. There are several ways to approach your problem. If the chips are bumped you will need to have a stencil to apply the flux. If the chips are u
Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold
We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout
Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW
Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se
Electronics Forum | Mon Feb 11 21:54:14 EST 2002 | davef
LONG TERM Your plans to buy a vaccuum bag resealer and a batch drying oven sound good as you say, but you�re correct. They will not help with this current situation. SHORT TERM If your connections are clean, free of pits and holes with a smooth,
