Electronics Forum: package (Page 268 of 288)

Moisture free storage units.

Electronics Forum | Mon Jun 16 17:13:24 EDT 2003 | fmonette

John, Maybe you know this already but I just wanted to highlight a few facts about dry cabinets. My experience is that many engineers are not well aware of the industry guidelines and sometimes will buy a dry cabinet without understanding the key f

Humidity of SMT component storage environment.

Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette

Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o

Substrate Au/Ni thickness

Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef

Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat

Ready, Shoot, Aim!!!!

Electronics Forum | Fri Mar 16 08:26:01 EST 2001 | Robert J. Latino

Dear David, Like Mr. Robert Nelms, I must be included in the "anal" consultants category. While I understand your frustration and dissatisfaction with whatever approach you were using, there is progress being made out there. The "right" consulta

Part sliding in reflow?

Electronics Forum | Tue Apr 17 21:05:06 EDT 2001 | davef

So, we�re talkin� �bout the smaller end of a "large" paper clip after it�s unfolded once, eh? In keeping with your "nothin� up the sleeves" full disclosure, I�ll bet you�re feelin� a little sheepish about not tellin� us about: * Antenna pad dimen

Mydata vs Siplace

Electronics Forum | Fri Apr 26 08:38:14 EDT 2002 | ian

We have had Mydata for eight years and Siplace for six. We have found that the Siemens is much more accurate and faster than the Mydata (about four times quicker). Although the Mydata is more friendly regarding the software, if the upfront preparator

OSP vs HASL

Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri

The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav

Re: Component Package Specs

Electronics Forum | Wed Jan 12 14:43:54 EST 2000 | JAX

Doug, Jedec has this info. Here is a few for you to use. LENGTH, L+LEADS, WIDTH, W+LEADS, PITCH, AVG. HEIGHT. 1. CQFP100AC: 17.28,22.35,17.28,22.35,.635,4.92 2. CQFP100AF: 32.52,37.59,32.52,37.59,1.27,4.92 3. PQFP100AD: 19.05,22.35,19.05,22.35,.

Re: Moonman - may I join you?

Electronics Forum | Thu Nov 04 23:45:16 EST 1999 | Jeff Sanchez

Hey Brian, We are not sure what it is you are referring too? If you feel they did not respond promptly than I am assuming that you picked up the phone and asked them what's up? Your thread just came across as bashing and a little negative, as

Re: Rephrase : mixed technology criteria.

Electronics Forum | Mon Oct 11 13:44:29 EDT 1999 | Dave F

Ken: Since Earl is no longer here, I guess I'll bite on this. Your questions are very broad and difficult to answer specifically. So, I'll give you broad and non-specific answers. | Hi, | | We are using mixed technology in our PCBA. Would like to


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