Electronics Forum | Wed Jun 16 07:34:17 EDT 1999 | Glynn Technologies and Manufacturing
| | We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centr
Electronics Forum | Mon Mar 17 11:56:38 EDT 2008 | dyoungquist
We have had VERY GOOD free tech support from Mydata. However, we bought a refurbished TP9 directly from them. I believe if you by a used MyData machine from someone else there is a fee to register your company and the machine in their system before
Electronics Forum | Wed Jan 29 14:22:56 EST 2003 | russ
Most bowing I see is caused by an asymetrical layer stackup of the PCB. (different copper thicknesses throughout the stackup) e.g. for a 4 layer board - 2 oz. copper on layer 1, 1 oz. copper on layer 4, etc... I would doubt that is the V-score since
Electronics Forum | Mon Nov 17 11:09:56 EST 2003 | Frank
Hi, I have a soldering problem with a header SMT straight single row of 8 pins. It's a samtec #TSM-108-03-T-SV-P (P&P). The first problem I have is an allignement one. I do not use alignement pin for now but I expect to use it. Concerning solder
Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit
X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep
Electronics Forum | Tue May 16 11:58:27 EDT 2006 | jsloot
What is the best or ideal cleaning method for wave solder pallets? I have been using iso prop and am not sure if this is the cause for having brittle wall material. I wouldn't think alcohol would degrade the durastone material. Most of my pallets hav
Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong
I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material
Electronics Forum | Wed Jun 02 09:21:34 EDT 1999 | Dan Burnikel
Hello all I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with Pol
Electronics Forum | Fri Nov 08 14:19:59 EST 2019 | dwl
You can try putting titanium stiffeners on the PCB to prevent it from warping. How thick is your stencil? More paste would give you a wider window however too much and you risk bridging. You could try over printing the pad at the heel and toe to get
Electronics Forum | Fri Aug 10 04:19:05 EDT 2001 | wister
There are lots of voids at solder joint of chips,the thickness of multilayer pcb is 3.2mm,top side have lots of chip component and bottom side has several BGA and QFPs.For top side profile,the preheat time is about 100s,soak time is about 75s,time ov
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