Electronics Forum | Mon Dec 17 19:01:45 EST 2007 | bbarton
As someone with a LOT of experience with the "low cost" alternative alloys, primarily SACX, I have one simple question....Are these shorts a new phenomena? WAS your process in control, and all of a sudden it's not? If the answer is YES, take a look a
Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
Electronics Forum | Mon Apr 01 07:41:40 EST 2002 | davef
Hey Bob, Boy, you are lucky to have a laboratory, and now colorful pix!!! The only silver IMC that you will see are: * Ag6Sn, much less likely at 'normal' soldering temperatures * Ag3Sn, much more likely Allowable silver concentration: * Below 2%
Electronics Forum | Fri Aug 08 07:15:49 EDT 2008 | davef
Hot tear occurs at the surface of the solder connection. The surface will look like someone tore the surface apart. So, it is a crack or fracture formed prior to metal solidification.
Electronics Forum | Wed Aug 06 08:09:57 EDT 2008 | davef
We agree that the squigglie part of the section of the BGA ball looks like something other than 'hot tear.' We'd guess that it is an inclusion, but it could be a sectioning defect, as you say. We agree that the majority of occurances of hot tear are
Electronics Forum | Sun Mar 31 10:03:25 EST 2002 | Bob
Cheers Dave, to answer some of your questions. � The component lead is copper with a tin / lead coating. The pads are standard Copper / Nickel / Gold. � The solder is standard Tin / Lead / Silver (2%) We have a lab that can determine the composition
Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j
Electronics Forum | Tue Aug 12 15:34:37 EDT 2008 | grics
That is very interesting... I am curious though, why wasn't a plain blind rivet used? You probably can, but personally, I would be not want a solder joint holding the frame and the pcb... Mechanical stress on solder joints often leads to not good re
Electronics Forum | Mon Jun 21 12:08:17 EDT 1999 | C.K.
| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an
