Electronics Forum: wire (Page 29 of 139)

Large Area Wire/Wedge Bonder

Electronics Forum | Tue Mar 16 18:36:11 EDT 2010 | janz

Looking for a large area wire ball bonder or > wedge bonder. Must be able to take 4" X 5" panel > and have a bond area of close to 3.5" X 4.4". > Also need 6 to 8 wire per second. K&S no longer > makes one. Panasonic no longer makes one. ASM

Re: Wires UNDER BGA?

Electronics Forum | Thu Oct 21 21:17:19 EDT 1999 | Jeff Ferry

Mark, A challenge for sure. I suggest you review two techniques for this type of rework\modification. The first method uses a special circuit track run out from under the BGA. See: Jumper Wires, BGA Components, Circuit, Track Method at http://www

Re: Screen tension (measuring)

Electronics Forum | Tue Mar 16 09:03:33 EST 1999 | Dave F

| Thanks Dave, | | But still I have the following question unanswered, in a technical point of view: | Has it sense to measure this on A system like we have now, because there are no wires that can be broken. | George: While I agree that no wires c

removing solder from a 0.015

Electronics Forum | Wed Feb 26 21:21:34 EST 2003 | davef

Try this: * Lay the board onto a solder pot with the via in question on the heat. * Push the wire into the via. * Step back and pat yourself on the back. Since you probably have components in the area of the via that you don't want to cook, try a va

removing solder from a 0.015

Electronics Forum | Fri Feb 28 01:25:44 EST 2003 | MA/NY DDave

Hi Wow, Sounds like a neat problem. As an other idea try inserting the largest wire you can get in the hole and heating the free end to wick solder up the wire away from the hole. I probably like the solder pot with a small nozzle the best so it h

Wire bonding on gold fingers

Electronics Forum | Wed Jun 25 06:43:06 EDT 2003 | cyber_wolf

We are currently producing a board for a customer that has about 400 gold fingers that get wire bonded after the assy. leaves our facility. We have tried many different approaches to ensure that we are not getting solder on the gold fingers. Nothing

Printing Problem

Electronics Forum | Fri Nov 19 18:02:03 EST 2004 | valuems

If it is a MPM printer you can install the environmental control unit. But it isn't as simple as most people thinks. You also have to install a thermostat inside the machine. Then there is a wire that is used to turn it on and off, this wire is fr

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood

We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood

We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg

IP1 Relay PCB, where is it???

Electronics Forum | Mon Dec 04 14:21:49 EST 2006 | jdengler

Todd, It's been a while since I have looked at this but I believe the IP-1 does not have a relay board for the feeders. +24 Vdc is wired to a pin on the connector and the I/O board (NO 3 I think) switches the ground. If you don't have +24 Vdc at 1


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