Electronics Forum: bga's (Page 286 of 546)

Conductive filled Vias on BGA

Electronics Forum | Wed Nov 30 22:25:03 EST 2005 | davef

The authors of this article might get you started http://www.protoengineering.com/documents/viaplug.pdf Other information is: * http://www.dupont.com/pcm/techinfo/general/general9.html *

Soldermask Defined BGA Pads

Electronics Forum | Fri Oct 15 10:23:48 EDT 2004 | mrmaint

Matt, are there any discoloration of the pads on the raw boards. i have seen what we refer to as gray pads. Ran into this in the past and it turned out to be a problem at the board house with one of their dipping tanks. The proper levels for the proc

Soldermask Defined BGA Pads

Electronics Forum | Fri Oct 15 10:38:42 EDT 2004 | mattkehoe

Thats what I was thinking especially because the pads are not round, they have jagged edges which to me indicates some kind of development issue. mk

Footprint for 48 ball .75mm pitch BGA

Electronics Forum | Wed Oct 20 11:32:23 EDT 2004 | pbatten

Has anyone seen a footprint for these new parts? If so where? Thanks http://america.renesas.com/media/products/common_info/package/mitsubishi/j48fhh.pdf

Footprint for 48 ball .75mm pitch BGA

Electronics Forum | Wed Oct 20 11:32:28 EDT 2004 | pbatten

Has anyone seen a footprint for these new parts? If so where? Thanks pbatten http://america.renesas.com/media/products/common_info/package/mitsubishi/j48fhh.pdf

X-Ray Criteria for BGA Solder Ball

Electronics Forum | Wed Oct 20 13:53:22 EDT 2004 | Greg D

Hi, What's the maximum and minimum solder void that can be accepted during X-ray? What about the percentage of Ball Roundness..20%? 30%? thanks and regards,

1mm BGA Underfill

Electronics Forum | Fri Oct 29 09:06:52 EDT 2004 | Rob

Hi Paddy, There's been a lot of low cost second user underfill equipment around recently, I've seen stuff go for as low as �20K - but make sure a dispense head is included. Good luck, Rob.

BGA Soldering

Electronics Forum | Mon Nov 01 15:35:25 EST 2004 | Ken

Agreed. You will find different part manufacturers have different coplanarity specs. In fact I have on supplier that calls out 7 mil max coplanarity. Then factor in board bow and twist and it becomes a real joy.

Via in Pad Production

Electronics Forum | Wed Nov 10 02:13:32 EST 2004 | Grant

Hi, We are thinking about starting to use via in Pad, for both BGA and 0402 and 0201 components. Does anyone know how this would effect production. Obviously PCB production is not difficult, but this should only effect production and assembly. R

CSP/BGA Applications

Electronics Forum | Tue Mar 15 22:10:39 EST 2005 | KEN

Why in Gods name would you use no-clean and then clean it? ....I guess I just don't get it.


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