Electronics Forum: sac305 solder (Page 30 of 34)

Flux activity with SAC305

Electronics Forum | Wed Jul 27 22:14:57 EDT 2005 | Ken

If no-clean...then this seems "relatively" normal. You could try and extend your peak and duration, however, manufacturers are adjusting their chemistry to survive these normal temperatures (up to 260C and 30 seconds within 5C of peak). You will h

Same wave process do not apply to all finish board

Electronics Forum | Fri Oct 14 17:54:15 EDT 2005 | Mika

Thanks Patrick for the replay, No, we do not mix the alloys nor Pb pcb:s/RoHS pcb:s in the case I described. It is simply as this: With both the different soldering processes we facing this phenomenon; but whith the RoHS SN100 or SAC305 it turns out

Need SN100C Reliability & Process comments!

Electronics Forum | Tue Mar 28 13:29:45 EST 2006 | solderiron

SN100C, not as aggressive towards other metals as are other High tin lead free alloys. Why? Sn63/pb37 The lead prevented the tin from being very aggressive. SAC305 no lead, silver instead. Silver doesnt block Tin from it's aggresiveness. SN100C no si

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 16:45:44 EDT 2008 | trynders

Thanks for the response! I thought is was odd the component vendor chose SAC for a lead frame finish. I am in the Military world, and things have been difficult to control from a lead-free standpoint. I have not been able to find any studies on SAC

SAC105 vs. SAC305

Electronics Forum | Wed Sep 24 19:18:53 EDT 2008 | ratsalad

We had a PCB vendor provide us with SAC105 plated HASL boards. They worked fine on the first pass through reflow. The second pass was not pretty. We couldn't get much of anything to solder to the board. That may not have been the alloy, it could

Conversion from SAC305 to SN100C

Electronics Forum | Wed Feb 04 08:28:07 EST 2009 | milroy

Hi, I have done conversion from SAC387 to SCS7 with great results on process improvement with low cost. I see only the melting point is higher but still the solder pot temperature settings is 250�C to 260�C as SAC. If somebody think the temperature

What is the preffered spacing between PTH and SMT pads

Electronics Forum | Thu Apr 30 22:40:32 EDT 2009 | davef

Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies Written by Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera Circuits Assembly Magazine, 31 December 2008 19:00

BGA Pad Cratering

Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289

This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i

Incomplete reflow

Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569

We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Mon Apr 26 17:09:05 EDT 2021 | kwalker

Sounds like you are getting oxidation of the nickel under the gold layer. If the gold is porous it will allow the nickel underneath to oxidize, which is the dark dull layer you are seeing, and why when you apply flux it solders just fine - the flux i


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