Electronics Forum: solder and paste (Page 293 of 752)

non-wetting

Electronics Forum | Sat May 18 07:36:31 EDT 2002 | davef

Copper teminations with no solderability protection on your LLP. Hmmm seems unusual, but it could be that the flux in your solder paste is not active enough to remove the corrosion on the Cu leads. OMG Microbond solder paste develops white residue

Reflow soldering issues

Electronics Forum | Sun Feb 11 23:18:44 EST 2007 | M.Haris

1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? 2. What is the �Low- Temperature Phase� in any solder paste alloy? 3.W

Solder Paste...

Electronics Forum | Sun Oct 17 09:27:58 EDT 1999 | Steve Restinetti (aka Bix)

Our SMT department uses Alpha Metals WS629 solder paste exclusively. Does anyone else use this paste and what do they think of it? I haven't evaluated other pastes yet and think that I'm sure there is something better out there. Feedback would be app

Reduce flux

Electronics Forum | Thu Jan 18 15:28:10 EST 2007 | CK the Flip

If you are, in fact, running a No-Clean solder paste: Different no-clean solder pastes will leave different types of (benign) residues. If your paste has been qualified from a Bellcore/SIR/Electromigration standpoint, any residues remaining will NO

SMT PRODUCTION ISSUES

Electronics Forum | Fri Dec 01 07:41:25 EST 2006 | realchunks

For reflow, bump up your profile as hot as you can go as allowed by your paste manufacturer will allow. If you can change solder paste without too much red tape, several solder paste manufacturers make a transitional paste designed for mix of lead a

Calculating Solder Volume

Electronics Forum | Thu Nov 08 21:46:09 EST 2007 | davef

In the marketing description of your paste, look for "percent metal by volume." This percent metal by volume figure gives you a good approximation of the amount of metal in each solder paste brick that you print on your board. In most solder paste fo

Nitrogen V.S Solder bridging problem

Electronics Forum | Sun Sep 09 10:53:05 EDT 2001 | bentzen

For reflow soldering, you are correct ! The higher surface tension of the solder paste in nitrogen atmosphere can increase the number of solder bridges if the component or solder paste print is inaccurate. Another defect that might increase is tomb

Soder Paste Shelf life extension

Electronics Forum | Sun Feb 20 20:52:26 EST 2011 | Jacki

I agreed not to ask the shelf life extension to the maker of solder paste. However, somtimes we have no chioce except using expired or used paste. When I have to, try the first PCB as a test. If Ok, just carry on other boards. Unless, use a new solde

Solder Paste Flux corrosive?

Electronics Forum | Tue Sep 15 21:47:59 EDT 2009 | davef

What flux did you use when you soldered with the wire solder?

Re: missing component after placement

Electronics Forum | Thu Jan 27 07:18:14 EST 2000 | Christopher Lampron

Dennis, The solder paste is responsible for holding the component in place pre-reflow. Several things to look at: Is the paste accurately printed on the pad? If not, there may not be enough of the component in contact with the paste to provide adiq


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