Electronics Forum | Fri Jan 15 08:43:43 EST 1999 | Mike McM
Bernie, If the pads are for a chip component and only about a half a pad off without anything else in the misregistered area, go ahead and use the stencil as is. Surface tension of the solder at liquidus should cause it to wick back to the pad, even
Electronics Forum | Fri Feb 19 13:26:28 EST 1999 | Brian
| I'm a 19 Year old singaporean student. | I need to do a report on solder paste dispenser. | i've search the net but to to avail. | Please help if you know anything about solder paste dispenser or have any info and pictures or charts of solder paste
Electronics Forum | Tue Jan 16 14:53:24 EST 2001 | davef
Yanno what's interesting on that topic? A small number of voids make the solder connection of a BGA stronger than no voids. Moral of the story ... don't get too anal about voids. You should check the archives ;-) [har har har] we've discussed this
Electronics Forum | Wed Jan 30 17:48:31 EST 2002 | davef
Expanding on a previous poster's comments ... Vapor Phase Soldering. A solder reflow technology that uses a heated solvent to melt the solder. Buried deep in the recesses of the SMTnet Library is �Terms & Definitions�. We started using vapor phas
Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
Electronics Forum | Thu May 24 14:44:42 EDT 2007 | colormaker
We use a washer soluable solder flux for our solder wave. We then wash the boards in a dishwasher. We have done it this way for years without problems. We just got a new dishwasher and now we get residue on the solder (white marks) Anyone know of wh
Electronics Forum | Thu Sep 02 06:22:34 EDT 2010 | sachu_70
Good. This is the right way to profile. Let me ask you, have you anytime soldered QFN componets on your boards? The concept of LGA soldering is similar to that used for a QFN package. QFN soldering also exhibits void formations, and is an inherent pr
Electronics Forum | Thu Apr 05 08:04:40 EDT 2007 | davef
On finding baking recipes in the fine SMTnet Archive, your problem is not in the flex portion. It's in the rigid [FR4] portion. On baking advice from experts look here: http://www.circuitnet.com/experts/EQ10120.shtml Finally, on reworking your ou
Electronics Forum | Thu Mar 16 19:12:22 EDT 2017 | pzappella
Hi Rob, Thanks for the LED paper. I like the void area equations but I am puzzled, the paper did not say if the solder was a solder paste that would generate a lot of voids, or a fluxless preform or sinter material. The measured voiding level
Electronics Forum | Wed Jan 31 17:04:22 EST 2001 | williamh
Hello all, I am having a problem with solder balls on chip resistors and chip capacitors. I have searched the archives and found some information concerning solder balls but have a couple more questions. 1. What is the realistic industry standard f
