Electronics Forum | Tue Aug 24 21:52:06 EDT 2004 | rose
recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was reflowed u
Electronics Forum | Wed Aug 25 20:48:17 EDT 2004 | rose
Hello recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was refl
Electronics Forum | Thu Nov 03 07:43:52 EST 2005 | davef
Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface con
Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood
We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg
Electronics Forum | Fri Mar 27 10:04:51 EDT 2009 | ericthered
We have been having problems with proper wetting when running mainly lead free but also leaded solder in our Ersa Hotflow 3. Solder either often looks grainy or doesn't flow over the whole pad. This is generally the case when my profile is 170 firs
Electronics Forum | Fri Jun 29 13:50:15 EDT 2012 | tbouslog
We are having some problems with parts that are glued on untill our PCBs go to wave coming off. We would like to test the stenght of the glue. Does anyone have any ideas on how to test pull off strength, torque strength, and push off strength? Any in
Electronics Forum | Tue Oct 17 17:27:08 EDT 2006 | adlsmt
Define "pretty easily". Did anyone ever do whatever is making them fall off now before? In most casses where a component "falls off" then someone implements a totally subjective test to make sure the rest of the parts wont "fall off" they damage a lo
Electronics Forum | Mon Jan 15 16:32:46 EST 2001 | Darby
Adrian, I'll go again. The term "snap off" on it's own refers to the distance between the bottom of the stencil and the top of the pcb. Sometimes referred to as "print gap". As you prefaced your question with "squeegee snap off" I thought you were as
Electronics Forum | Tue Dec 28 20:49:08 EST 2010 | wingding
We have an ERSA 500 and we need to pull the Pump Housing. The manual is pretty limited and it doesn't offer any information on how to remove it. Do we have to remove all of the solder from the pot first? Or is there some way to pull it without going
Electronics Forum | Fri May 15 09:41:58 EDT 2009 | cyber_wolf
Use loctite chipbonder and forget about all this pull testing. I know that Loctite works good because it pulls a chunk of solder mask off the board when you push a part off.