Electronics Forum | Thu Aug 05 13:37:28 EDT 2004 | davef
Baking your boards will redue the amount of OSP on the board. If you use the boards quickly, you probably will not have a problem with baking [and don't bake too long]. Why do you want bake this board?
Electronics Forum | Tue Feb 20 21:43:24 EST 2007 | sbkwak
Is there any technical reason why OSP finished PCB should not be baked? Your advice will be very much appreciated
Electronics Forum | Thu Aug 05 16:15:18 EDT 2004 | pjc
Are you considering baking due to moisture exposure? Not all OSPs are created equal. I would check with your PWB fabricator about dry times and effects on their OSP finish. After you get it, I'd still try just one PWB for bake-dry out and check solde
Electronics Forum | Mon Jan 08 10:41:50 EST 2007 | jaime39
If you bake the boards at 125 degrees celcius for about 4 hours it should work. I would also suggest that you talk to the PCB supplier to take care of this baking for you. NOTE: PCB�s with an Entek or any other type of OSP finish should not be baked.
Electronics Forum | Fri Aug 06 10:07:50 EDT 2004 | blnorman
OSP has limited elevated temperature exposure capability. Couple that with the fact that solvents (IPA in particular) will remove the OSP. The more material you loose the higher the chances for pad oxidation. We ran an experiment with board washin
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
Electronics Forum | Fri Aug 15 01:31:17 EDT 2003 | Jay
Hi All, I work for a contract manufacturing and we are having a new PCB to build. The PCB has OSP coating on it and it has been sitting open in the production floor for about 15 days. I am not sure weather it will affect the soldering process or not
Electronics Forum | Fri Aug 15 19:52:38 EDT 2003 | Jay
Dave, By Mishandled OSP i meant that it had been touched by bare hands (including pads). Its not like I want to or I donot want to bake these boards. Its just that i want to be sure that the boards will be good to use. And I like your idea to apply
Electronics Forum | Wed Feb 21 21:01:57 EST 2007 | davef
Yes. Heat reduces OSP solderability protection thickness. For instance, many OSP are shot at the end of the first reflow pass and the exposed copper is free to oxidize. If you're speedy, you can pull-off the second reflow cycle before the copper g
