Industry News | 2010-04-28 11:08:15.0
Attendees captivated with the SIPLACE SX scalable machine architecture
New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Industry News | 2004-05-04 09:35:13.0
Strong Investments Secure Future Growth
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Industry News | 2021-03-09 14:30:57.0
As electronic production test and measurement policies come into place, the demand for equipment to enable manufacturers to fulfil their obligations increases.
Electronics Forum | Wed Aug 11 06:27:07 EDT 2021 | danisa
Hi all, The PCBA was swollen after SMD It is hard PCBA with 6 layers and SMD both sides Defect rate: ~ 5% Phenomenon: swell at the same side, same position (at 2 IC positions). Did not find any abnormality in SMD process as well as storage condition.
Electronics Forum | Thu Jan 15 15:08:43 EST 2004 | mrmaint
Are your qfp's being stored properly. I have seen this in the past and it turned out to be a moisture issue. We saw most of the problems on the corners. The component would swell during the reflow process thus lifting the corners. After baking the re
Electronics Forum | Fri Oct 23 17:33:42 EDT 2009 | grizzy
Check that you are following the moisture sensitivity requirements for the part. I've seen the part swell underneath. You can contact me at wenroth@reconsales.com for more information. I am an 'ol reflow guy from the CM world. Wes
Electronics Forum | Fri May 21 09:48:30 EDT 2010 | tomg_fla
Am looking for a dispensable water soluble solder mask or peelable solder mask that can be dispensed and be run through a reflow oven with no swelling or degradation. Any leads on any materials or manufacturers to contact?