Electronics Forum | Wed Dec 28 03:33:31 EST 2005 | sparrow
I would like to know if ENIG is widely used for the thermosonic gold wire bonding or this application is an exotic one. And I also wold like to talk to someone who uses printed circuits with ENIG finish for such an application. I do not quite underst
Electronics Forum | Mon Mar 07 21:37:42 EST 2005 | ABHI
It depends on your product requirements. I have seen aluminium wire bonding operations in as high as class 100K clean rooms. These are the assembly areas for calculators. The best is class 10K clean room for wire bonding. You can go upto fine pitch w
Electronics Forum | Tue Dec 27 10:00:19 EST 2005 | sparrow
Hello, does anybody have experience in thermosonic gold wire bonding to electroless nickel/immersion gold?? regards, Sergey
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Sun May 26 10:21:46 EDT 2002 | V.RAMANAND KINI
We buy PCBs for aluminium wire bonding. Our PCBs have 0.25 mm square pads for bonding and 0.10 or 0.15 mm gap between circuit traces/tracks. We do not have any problem. Our vendor gives 9 microns of Nickel and 0.03 microns of gold.
Electronics Forum | Wed Dec 28 21:18:12 EST 2005 | davef
You don't TS bond gold wire to nickel [of ENIG] for the same reason that you don't TS bond gold wire to hard gold. [Nickel or maybe cobalt is used to harden soft gold.] Together nickel and gold produce unreliable bonds. Look here: * http://www.smta.
Electronics Forum | Tue Dec 27 14:51:49 EST 2005 | davef
What's the issue and situation?
Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef
4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas
Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you
