Electronics Forum: past (Page 301 of 989)

Re: SMT PCB prototype

Electronics Forum | Wed Apr 26 22:34:49 EDT 2000 | Eric Chua

1. Verify all the part had load to machine. Get ready for the profile. 2. Run the board with double side tape. Is better to run one board for each machine. 3. Verify all the placement ( missing, misalgnment,etc )and check the value using meter for a

Open v.s viscosity

Electronics Forum | Tue Apr 18 08:05:00 EDT 2000 | Wister

Hi, I got an interesting result after completing DOE that more open defects occurred higher the viscosity.The ppm would be 500 while the viscosity is 950 and it would be 1500 while the viscosity is 1050.The range of viscosity is 900 ~ 1100kcps. The p

Paste Tack Time

Electronics Forum | Fri Mar 24 03:06:35 EST 2000 | Sal

guys Using a well estrablished water soluble solder paste, but having problems with tack time. Data sheet recommend a couple of hours but we are seeing problems after about 15 minutes with 0402/0603 componenets bouncing off. The printer environment

Re: Solder cream kits (flux and powder separately)

Electronics Forum | Fri Mar 03 09:48:06 EST 2000 | Wolfgang Busko

I have heard about it. The main reason is to save money. The problem is, or better is said, that the mixing isn�t that simple for you got have a homogen paste afterwards and the solderballs shouldn�t be deformed in size so that problems during printi

Re: Cleaning No-Clean Paste??

Electronics Forum | Wed Feb 23 21:35:01 EST 2000 | Dave F

Larry: You're correct to question this: * We don't like to run raw paste through our aqueous cleaner. It makes a blinking mess. Your entire machine is probably now coated with hazardous material ... well at least the first tank and the out-bound

Re: Cure/Reflow Profile

Electronics Forum | Tue Feb 22 14:20:55 EST 2000 | Sal

Please let me rephrase the question. Running passive side first and curing the adhesive using a reflow profile derived for 63/37 solder paste. After curing the board is flipped around, pasted and reflowed. My concern is when curing the adhesive usin

60 Deg or 45 Deg Blades

Electronics Forum | Thu Mar 15 09:30:01 EST 2001 | keith47611

We've actually seen best results with 60 degree blades (as measured from stencil surface to face of blade), and paste sticking has not been a problem since we switched to a higher quality metal blade. More expensive than the OEM stuff but worth it.

Paste life span on the printer

Electronics Forum | Wed Mar 14 01:45:46 EST 2001 | Yngwie

In my factory, we are setting the shelf life of paste on the printer to be 2hrs. What is the best way to measure this and when does the 2 hr start? It is quite difficult as sometimes the line is down for 1 hr and then start again. Should we cummulat

Paste life span on the printer

Electronics Forum | Wed Mar 14 22:41:03 EST 2001 | CAL

There are also Process monitoring tools that mount directly to your blades and monitor the paste. Impedance Spectroscopy is the process monitoring theory behind the tool. It works by having good sample data logged that the monitoring tool can compare

Solder Paste Volume

Electronics Forum | Thu Mar 29 01:22:57 EST 2001 | chinaman

Hello everybody, Two questions came up during an audit (old topics once more): 1. we are not checking the solder paste volume/pad height after printing - others are using an AOI, but is it really necessary? We just do visual inspection randomly. We


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