Electronics Forum | Thu Jul 11 18:00:34 EDT 2002 | jax
Tony, Do an archive search for "lizard". Some times all you really need is a lizard tongue. No machine is complete without one.
Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris
Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks
Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef
No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi
Electronics Forum | Wed Apr 04 18:27:53 EDT 2007 | Guest
Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results
Electronics Forum | Fri Apr 06 01:10:16 EDT 2007 | Haris
My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.
Electronics Forum | Fri Apr 06 08:32:47 EDT 2007 | davef
Haris: On your soldering issues, we don't know the make-up of your component. We don't know the type solder balls on the component. We don't know the solder paste you plan to use. Your component and paste supplier are better sources for this type o
Electronics Forum | Mon Oct 21 11:03:15 EDT 2013 | davef
I don't know about the papers that you seek. Try: Rakesh Kumar, Specialty Coating Systems, Inc., 7645 Woodland Drive, Indianapolis, IN 46278; 317-472-1266 F317-244-1215 rkumar@scscoatings.com
Electronics Forum | Thu Jul 18 04:06:26 EDT 2019 | artem
Thanks for the info. And what about accuracy of the placement. Are both machines able to handle the same parts or are there any differences like for small components or BGA?
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
