Electronics Forum | Fri Dec 17 16:07:07 EST 1999 | Alex B
Hi, C.K. Let's assume that your stencil's thickness is in a range 4-6 mil or by other words the height of the solder paste on a pads is the same (close enough to reality) Therefore, for pad's width more than 20 mils(as well as pitch between pads) th
Electronics Forum | Wed Dec 14 07:38:56 EST 2005 | tk380514
the original question was: Please give me some guidelines on designing Stencils for Fine Pitch. which i did however, 40% fallout for solder shorts this could be caused by many other processes having gone wrong before, i.e. type of solder paste
Electronics Forum | Sat Dec 17 11:45:40 EST 2005 | DAM
You know, many SMD components have copper alloy leads and then a copper (or Ni) barrier on them. On the copper (or Ni) barrier there is the finish. Usually the finish is made of Sn\Pb (tin-lead), and if I solder with a Sn\Pb solder paste it's all rig
Electronics Forum | Fri Dec 28 15:37:06 EST 2007 | realchunks
OUCH! The ol' boss went to a seminar clich� eh? That�s a killer. Especially if it�s salesperson driven (which most are). Almost as bad as when they pick up Circuits Assembly or Assembly Magazine. OK so you�re stuck doing this process. I would
Electronics Forum | Sun Dec 10 20:17:51 EST 2017 | myke03o
Hi Dave, thanks for the response. * Improve your products that are used for thermal cycling testing of products of other companies? Yes we want to improve our products to pass thermal cycling and prolong the lifespan of the baord. * Change your pr
Electronics Forum | Fri Dec 27 12:47:21 EST 2019 | ameenullakhan
Dear Team, We are facing open solder issue in a sensor component. Rejection rate is 2 out of 50 components placed. The issue is very random. We have tried increasing the solder paste height from 5 mil to 7 mil. The issue persist still. Differen
Electronics Forum | Mon Oct 11 13:17:36 EDT 1999 | Dave F
| A board shop rep contacted me about a process were solder paste is applied to the board as part of their mfg. process thereby eliminating the need for paste application at the assembler. This is a new one I have never heard of, but am willing to si
Electronics Forum | Sun Aug 22 06:34:40 EDT 1999 | dreamsniper
| | Has anybody run across a good concise book or other source on solder paste, its characteristics, handling, storage, stencil design, printing and reflow? Yes I asking for the world! | | | | TX | | Mark | | | As the world turns, or is/was that a
Electronics Forum | Wed Apr 28 04:26:24 EDT 1999 | Nigel Burtt
| Hello all, | | I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area
Electronics Forum | Thu Apr 15 00:26:38 EDT 1999 | Owen
| I need help in finding solder paste measuring equipment. | No matter what measuremnt system you purchase, make sure that you perform a Gage R&R study to determine whcih system can meet your standards. Most manual measuremnt systems cannot adequa
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