Electronics Forum | Mon Dec 06 12:27:01 EST 2004 | Scott B
We are currently reviewing a design which has a leadless chip scale package with a solder thermal pad on the underside. The application notes for the device specify use of a no-clean solder paste as the gap under the device will prevent cleaning. Is
Electronics Forum | Wed Apr 06 21:37:35 EDT 2005 | KEN
Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? This means your thermal profile is not hot enough. why the sudden cahnge? I will bet the lead frame material was copper and is now alloy 42. sounds like
Electronics Forum | Thu Jul 07 08:06:53 EDT 2005 | stepheniii
Get some free samples if you can. We have at least a couple solder reps who would not sell you a jar untill you have tried a free sample first. Preferably with them on site when you try it to help you with any issues that might come up. They want to
Electronics Forum | Tue Nov 01 08:50:26 EST 2005 | James
I've recently been subjected to a procedure that requires the first 2 solder paste prints of a production run to be wiped down and not used for the build. This is to condition the stencil aperture walls? and insure good print deposition. Is this a
Electronics Forum | Mon Dec 12 14:04:33 EST 2005 | craigj
Hi All was wondering is there anything I should be aware of or look out for if using parts with SnBi (Pb free) lead plating with Sn/Pb/Ag solder paste? I was always lead to believe that mixng lead and bismuth caused problems or are the bismuth levels
Electronics Forum | Fri Dec 16 10:45:41 EST 2005 | campos
Hi,, My doubt is regarding to the Reflow Time, I mean, in a 5 or 7 zones oves, how long the board should stay inside the oven to complete the soldering cycle? 4 min, more, less...Should I keep low temp until peak for a long time or high temp in shor
Electronics Forum | Wed Feb 08 03:07:25 EST 2006 | Ajay SHarma India
Sir i have a question on Backing of Cards. pls. clarify me that Why we always do backing of cards(90 dC for 1hr. in a Oven) for the reflow process before printing the solder paste on the board. and same for the Curing process we are not backing the
Electronics Forum | Wed Feb 22 08:01:42 EST 2006 | INGE
We have a new SMT line, our customers are asking us the validation of the process. Not only the validation of the resulting assembled board (solder joint...) but also a validation of every single machine in the line (ex. stencil printer...). For exam
Electronics Forum | Wed Oct 04 11:36:06 EDT 2006 | flipit
Hi, Anyone ever have an issue with stray capacitance when using no clean solder paste. We are having a timing problem on one product. The problem goes away when we clean the assemblies. We use a no clean process normally. These assemblies worked
Electronics Forum | Wed Feb 14 10:10:55 EST 2007 | rob_thomas
The challenge regarding the stencil was mostly due to the actual board layout and nothing having to do with the voids in the solder. It was my first encounter with 0.5 mm pitch on BGA and dealing with a LF solder paste with higher viscosity than tha
