Electronics Forum | Mon Jul 07 11:36:11 EDT 2003 | slthomas
It's definately soldering because the fillet is pulling the solder plating (I believe, from what I can see under available magnification) off of the termination, and some of the nickel plating as well.
Electronics Forum | Mon Feb 02 12:57:40 EST 2004 | kauer
Hey, Give me a few minutes, I just happen to have a DEK not being used right now, let me pull the front cover off to refresh my memmory, I think there is a Gain POT in there somewhere.
Electronics Forum | Tue Jul 27 07:18:44 EDT 2004 | Nippy
How does the HASL finish and stencil match ? I have seen ocasions on fine pitch devices where the HASL can protrude into the stencil aperture either pulling paste down on the snap off or completely blocking the aperture and getting no paste.
Electronics Forum | Fri Sep 02 06:47:17 EDT 2005 | dougs
Is there a standard that we should aim for in respect to the strenght of the solder on SMT leads? We have a customer who are testing our product by pulling leads off of pads then returning them.
Electronics Forum | Tue Jul 18 07:50:47 EDT 2006 | adlsmt
Are the leads actually pulling off the pads or are the pads coming up as well? Did you ever try this "experiment" before you used lead-free?
Electronics Forum | Tue Jul 18 09:53:30 EDT 2006 | slthomas
What do the leads of the components look like when you pull them off? Are they covered in solder? Did the plating stay on the solder fillets attached to the pads?
Electronics Forum | Sat Jan 19 10:58:23 EST 2008 | slthomas
That's a good idea. We did pull the bridge piece off of one just to see what happens with the receptacles only, so no flux blockage. They flowed great with no blowholes, but also filled with solder. :/
Electronics Forum | Tue Apr 15 13:08:58 EDT 2008 | abaumann
If the solder had formed an intermetallic then it couldn't have pulled off completely like it did, it's obvious that the boards have a problem with their finish.
Electronics Forum | Thu May 08 10:44:59 EDT 2008 | swag
We have a Crown Simplimatic 8260. Footprint is 36" (line flow) x 31" (front to back). Reach is 36". Pulled it off line a couple years ago but works great. It's collecting dust - we'd be more than happy to part with it cheap if you're interested i
Electronics Forum | Tue Aug 25 13:30:35 EDT 2009 | rossi
It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attac
