Electronics Forum | Wed Aug 22 02:01:03 EDT 2007 | lococost
Have you tried the same setup with your leaded paste? Your lf paste might have different cold slump characteristics.
Electronics Forum | Sun Sep 02 19:06:03 EDT 2007 | gioblast
that I Can still use my old laser cut stencil that I used in leaded process? and also my wave pallet that I have used in leaded process? Your comment is highly appreciated for all lead-free transition recommendation and control.cheers n rgds
Electronics Forum | Fri Sep 28 23:22:19 EDT 2007 | anne0405
SMT splice product(splice tape,splice cutter,splice tool,extender,stencil clean rolls and so on)with best quality and resonable price. pls visit http://www.khj.cn email:sales@khj.cn
Electronics Forum | Thu Sep 13 01:37:15 EDT 2007 | pavel_murtishev
Good morning, Overprint, i.e. make stencil openings for your LED larger. Add printer accuracy to aperture size so that paste would always cover the pad. BR, Pavel
Electronics Forum | Thu Oct 18 10:50:11 EDT 2007 | cyber_wolf
Yup... I do indeed need a .030" foil. It is for a special adhesive printing application. And FYI I did find stencil houses that will do .030 foils. Thnx
Electronics Forum | Mon Nov 05 16:54:00 EST 2007 | bbarton
There are several things that can be done to increase throughput on you screen printer, including the panelization of your bords as Steve & Hussman has pointed out. However that's of limited use if you have plenty of stock that is not panelized. That
Electronics Forum | Thu Nov 08 07:33:23 EST 2007 | hussman
Why? Just use IPC on finished solder joints as your guide. I've seen groups of people puts hundreds of hours into this task and then tell me a 3 mil stencil is all I need. After reflow, none of the solder joints meet IPC Class 1 and a lot of tombs
Electronics Forum | Thu Nov 08 13:00:33 EST 2007 | russ
Just how accurate do you need to be Matt? you seem to already know the answer, calculate the volume deposit from stencil aperture and divide x 2? that will get you very close wouldn't it? Russ
Electronics Forum | Mon Nov 12 09:37:17 EST 2007 | russ
You need to perform process a capability study prior to putting these controls into place. Cleaning a stencil after each pass will get ugly, solvent residues remaining in apertures etc. 2D inspection is good. Change paste every hour will get very
Electronics Forum | Thu Nov 15 09:29:03 EST 2007 | jaimebc
Just to add to the subject, we experienced insufficient solder on our QFN's at our prototype level. To correct it, we went to a 5 mil stencil, 20% reduction on QFN pertures and used QFN's with solder bumps on the pads. We had great results using thi
