Electronics Forum | Wed Jun 28 12:29:56 EDT 2000 | Christopher Lampron
Does anyone know what the min-max plating thickness for HASL is? Is there a specification that defines this requirement? We have had problems with PCB's that have excessive solder plating on the pads. This wreaks havok with our QFP's. Any help would
Electronics Forum | Tue Aug 31 13:23:37 EDT 2004 | frankracine
Thanks Ken for your reply. Concerning OSP, there are a few negative points that I must considered for our application. I've read all the following points in an Entek document. Never test it. - If you have a miss print and you clean the PCB, the co
Electronics Forum | Thu Apr 24 23:04:45 EDT 2003 | yukim
I've been struggling with this problem for a while. We have two products: A, which is Ok and B, with tombstone defect (0603 & 0805 capacitor chips). A & B have the same design: pad sizes, separation between pads, components orientation. Both have s
Electronics Forum | Fri Sep 24 09:49:53 EDT 1999 | C.K.
Hi Folks: We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. The bridging is happening after coming out of reflow...one last thing t
Electronics Forum | Mon Mar 08 09:03:17 EST 2004 | russ
Is this problem really related to the size of the BGA OR the size/thickness of the PCB? Would I be correct in assuming that your pre-heater is small in size? Usually a board warps like this when the ramp is to great at the localized area. the imme
Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin
Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole
Electronics Forum | Wed Jun 22 18:52:56 EDT 2011 | semiconjt
tTo explain what I mean...sorry for my bad Engilsh... please find short " patchwork stencil" description from EPP Europe. http://www.epp-online.de/europe/-/article/16537487/15944614/Innovators-of-laser-processing-technology /art_co_INSTANCE_0000/max
Electronics Forum | Tue Sep 24 23:02:59 EDT 2002 | redmary
For the COB process, what thickness for plating Au is suitable? IS there any specification for this issue?
Electronics Forum | Mon Jun 07 18:00:06 EDT 2004 | Rob
Board is .09" thick not .9". Sorry
Electronics Forum | Tue May 21 09:16:28 EDT 2013 | hussman
What size QFN? What stencil design and thickness are you using.
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