Electronics Forum | Tue Mar 20 09:03:18 EST 2001 | moseschee
Hi, I'm looking for research/study done on solder shelf life by using accelerated aging process ( steam age or dry air oven bake at 150C & etc ) Perhaps you could help to advise correlation of all this acceleration test to actual solder shelf life
Electronics Forum | Mon Apr 09 07:12:17 EDT 2001 | Reg
I was wondering if anyone could advise me as to the thickness of a selective jig for wave solder. We currently run with a difference of ~6.7mm from the base of the jig to the base of card which to me seems too deep but this is what our jig manufactur
Electronics Forum | Tue Oct 24 17:01:20 EDT 2000 | Philip A. Reyes
Hi! Good day!! My questions is about PBGA rework the ff are: 1. Is it necessary to reball the plastic BGA module after removing it from the PCB? Can you give me the process and critical requirements?(e.i.stencil) 2.After removing the PBGA modul
Electronics Forum | Fri May 04 18:24:48 EDT 2001 | ashokdha
I am looking for an IPC Standard (s) or other standard (s) for electronics assemblies. The kind of operations involved are riveting, assembly of backpanels and circuit cards into metal shelf, wire wrap , soldering , contact pins , cabling etc.
Electronics Forum | Thu May 10 15:48:12 EDT 2001 | kp
Good morning, We are presently using a couple surface mount parts on our circuit boards. We send the boards out of house to have the SMD parts placed. I have been told that the apertures for the stencil for each SMD are not to be 1:1 with
Electronics Forum | Tue May 22 00:01:43 EDT 2001 | philipreyes
Hi to all!! For those who have current process of Placing BGA package (SMT using BGA package), do you have any idea what is the acceptable misalignment of the balls on the pads of PCB? I have here with me the IPC 7095 BGA Assembly and Design but
Electronics Forum | Tue Dec 21 00:10:00 EST 1999 | Edmund
Currently i am producing a board using dloble reflow process. The bottom side is mostly 0603 chips and some SOIC. The top side is mostly QFP and some heavy component. During the double reflow process , the capacitor chip on the bottom side drop(same
Electronics Forum | Fri Dec 03 12:45:28 EST 1999 | Bill
I'd like to print out a forum item to fax to a friend who does not have internet access or email yet at his new facility, but no matter what I do to my printer set-up I cannot get the full page width to print. The right side of the message keeps gett
Electronics Forum | Thu Nov 18 14:40:18 EST 1999 | John Queen
Hi Charley Having worked on the QP2 for some time now i have my doubts about its versatility,this machine is my opinion a cheaper alternative to the IP3,which is far more accurate and more reliable. I would advise yo
Electronics Forum | Thu Oct 14 04:28:29 EDT 1999 | Grace Chua
Hi there, I have quite a number of problematic bd due to warpage problem. I would like to know the method on how to measure PCB warpage, thus to decide on the dispositon of these boards. Another question, can these warp bd be rework/fix. Is there
