Electronics Forum | Wed Jan 13 15:43:00 EST 1999 | Dave F
| How is everybody? | | I was asked about any problems that would be associated with having a plastic casing injection molded around an assembled PCB. I am not sure if injection molded plastic has to be hot, I am assuming so (can they use epoxi
Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund
We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S
Electronics Forum | Thu Aug 06 13:02:11 EDT 1998 | Brian Stumm
Tombstoning is often caused by non-uniform heating. I suggest you check you profile to ensure you still have uniform heating and also check your rise and cool rates. If you have a convection oven I would look into the fan speeds or airflow rate throu
Electronics Forum | Tue Jul 14 13:23:59 EDT 1998 | Tom
I am looking for some general information with respect to BGA devices on circuit boards. I work for an automation company and am curious to know who's doing what with BGA placements, specifically the heat - sink application to the BGA device. General
Electronics Forum | Mon Jul 06 19:35:08 EDT 1998 | Steve Gregory
Hey Dave... The only reason I can think of wanting the boards good and dry after the wash is just what you've listed...power-up. I had some boards that went right into ICT right after the cleaner but still had a little water in the right angle c
Electronics Forum | Thu May 28 08:56:12 EDT 1998 | Earl Moon
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Fri Jan 16 23:33:32 EST 1998 | Scott
| Is there any way to implement SMT at home? | I want to assemble a prototype board of mine. | How can I hand-solder a 208-pin 0.5 mm lead | pitch PQFP -- lead-by-lead (the usual way), | or side-by-side (partial heating method)? | Alas, no SMD rework
Electronics Forum | Thu Dec 20 12:27:25 EST 2001 | seand
Hello Gentlemen, Dave has a good point. Proposing to move the rails for the sake of thermal integrity doesn't seem logical to address you issue. By adding a rail set you have simply added mass (almost like big heat sinks) throughout the oven vs. w
Electronics Forum | Thu Feb 28 07:57:52 EST 2002 | caldon
Marcos- BGA's and soldering manually is difficult. Typically soldering BGAs requires reflow just as a reflow oven does, so I recommend a rework station. Go to http://www.empf.org/html/empfset.htm and download Jan 2002, Dec 2001, Sep 2001, Aug 2001,
Electronics Forum | Fri Aug 16 11:03:22 EDT 2002 | Claude_Couture
I use Kyzen's Aquanox SSA cleaner in a heated parts cleaning tub to clean anything with flux condensate on it. When heated to 120F, the stuff melts away like ice under hot water. When the cleaning solution is loaded, I send it in an evaporator. The s
