Electronics Forum | Thu Sep 25 16:50:50 EDT 2008 | glennster
Ditto here, also. This is generally referred to as �cratering,� and is associated with stress on boards from operations such as ICT, installation of compliant pin connectors, and depanelization. It is more common on PCBs designed for Lead-free proc
Electronics Forum | Tue Sep 16 16:51:25 EDT 2008 | vladig
Even BGA may be no braner if it's done properly :-) I had a few cases with that and afterall it worked fine. :-) I agree, it was a good think to mention. Vlad
Electronics Forum | Fri Oct 03 01:01:09 EDT 2008 | khushi
Dear All, I would like to know that what are the problems which will be encountered while mounting 01005 components & BGA's on the PCB for thickness 0.2mm and what will be the processes involved in mounting the components.
Electronics Forum | Wed Nov 05 13:17:58 EST 2008 | mrmaint
Take a look at your profile. Early on in the development of our leadfree process we saw excessive voids on BGA'S. We tweeked our reflow profile and were able to bring our voids down to about 9% or less. Also found that some paste mfgs. worked better
Electronics Forum | Wed Dec 17 08:43:14 EST 2008 | stiva
Have seen this problem on other types of oven and it was caused by failed solid state relays that energise the heaters.
Electronics Forum | Tue Feb 10 22:20:16 EST 2009 | stevek
Looks like an improvement to the spinning stuff, but gads, I wish these people would stop using the term slice. The Teradyne still does not create a slice. It infers things from different sized shadows. It still cannot actually image a slice thoug
Electronics Forum | Mon Jan 26 11:58:06 EST 2009 | ghcarnu
Hi there, where can I find some hints about placing the temperature sensors on the pcb when determining the reflow profile? I'm interested especially in the case of a pcb having BGA's. Thanks for your answers ! gheorghe
Electronics Forum | Wed Mar 11 07:45:57 EDT 2009 | stevezeva
Might want to look at this: http://www.pdr-rework.com/pdfs/IR_XT5_Professional.pdf We recently purchased one here and I love it. Steve
Electronics Forum | Thu Apr 09 09:23:29 EDT 2009 | ed_faranda
Well, I did manage to solve this problem. I lowered the max boards temp from 245 to 235. Then I decreased my TAL. This seemed to work perfectly. Thanks everyone for your suggestions! They got me in the right direction.
Electronics Forum | Thu Apr 23 15:46:08 EDT 2009 | ccross
During initial profiling we shoot for 15% or less voiding on our BGAs. During production runs we consider voids under 15% to be ok. Voiding between 15%-25% we string tag and pay more attention to during test. Over 25% we consider a reject.
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