Electronics Forum: index (Page 3171 of 7894)

solder paste(SnPbAg)

Electronics Forum | Mon Aug 04 15:26:20 EDT 2014 | cyber_wolf

Whether or not SnPbAg will cause issues is trivial. You must build to the solder specified on the print.

solder paste(SnPbAg)

Electronics Forum | Mon Aug 04 15:46:05 EDT 2014 | dyoungquist

What do you mean by "airborne"? We have been using SnPbAg for 15+ years to build assemblies to IPC class II standards although with most assemblies going to Pb free, we are not using it near as much as we used to.

solder paste(SnPbAg)

Electronics Forum | Thu Aug 07 12:58:59 EDT 2014 | kahrpr

One of the things you need to know are the parts you are building Flight Critical. Meaning if the board fails will it bring down the aircraft. Or non critical meaning one of the over head light will fail as an example this determines how much latitud

solder paste(SnPbAg)

Electronics Forum | Thu Aug 07 23:18:27 EDT 2014 | madhuranatha

Sir I more information i did not shared with you. The finish of this critical board is ENIG. Do you recommend ENIG finish for the flight critical boards

Camalot 5000

Electronics Forum | Wed Aug 13 12:06:40 EDT 2014 | deanm

Try Precision Placement Machines. I know they support and sell Camalot 5000 systems. Precision Placement Machines, Inc. 326 Main Street, Unit 11 Fremont, NH 03044 Telephone: (603) 895-5112 Fax: (603) 895-5113 www.goppm.com I am in no way affiliate

Manually Adding Paste at Screen Printer

Electronics Forum | Mon Aug 11 13:04:38 EDT 2014 | emeto

paste should be 12-16mm in diameter. If your squeegee is the same size as your roll you shouldn't observe any difference for 15boards. Adding paste is important when you run hundreds and thousands of PSBs.

Does IPC definition for "QFN Void Ration" ?

Electronics Forum | Sun Aug 10 21:57:25 EDT 2014 | cmchoue

Does IPC definition for "QFN Void Ration" ? Like IPC 7095 susgestion the BGA Void ratio.

Does IPC definition for

Electronics Forum | Mon Aug 11 08:15:15 EDT 2014 | emeto

there is no clear percentage for the total voiding, but I know that single voiding shouldn't cover two via holes(defect)

Pull test norm for adhesive smt.

Electronics Forum | Tue Aug 12 09:52:58 EDT 2014 | thiagofrego

Would like to know if some exists norm that refers the parameters for test of extraction (pull test) of components SMD using adhesive.

Mirae MR20LP

Electronics Forum | Wed Aug 13 06:40:35 EDT 2014 | rusigan

We are having a problem setting up the Mirae MR20LP Pick and Place Machine.For some reason the program cannot see the feeders.All the feeders in the program are in Yellow which means FEEDER MISSED but supposed to be green.


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