Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb
Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m
Electronics Forum | Wed Mar 19 15:59:40 EDT 2008 | rmitchell
Hi, I am having some problems with my CP6 placement changing in the Y axis. I had to move all parts by +.12mm this morning. Then after 20 boards the placement shifted too high by about .12 mm The IP stayed the same with the same pcb's and fid coo
Electronics Forum | Thu Mar 20 07:58:12 EDT 2008 | cyber_wolf
#1Run a Fuji gold board and see if the problem persist. Is your board clamp slipping? Fid camera tight? etc.. To see if you have a Y axis positioning problem: 1.Put the machine in mecha check 2.Go into Y-axis 3.Place a dial indicator so that the st
Electronics Forum | Thu Mar 20 09:55:11 EDT 2008 | swag
We have a class 3 SMT build that requires the paste conforms to J-STD-005 RE LO. We have not used a low activity flux in the past and would prefer not to have to change our wash process or change to no-clean paste for these builds. I have researche
Electronics Forum | Wed Mar 26 09:32:46 EDT 2008 | nibirta
well i do not know if u fixed this problem already. But i cand share form my experience some info with u. We used a vigon A200 solution for such an application. the cleaner is good. But...it gives u troubles depending on the quantity of flux. It can
Electronics Forum | Wed Mar 26 18:54:56 EDT 2008 | swag
Thanks for the replies. Our customer has shifted toward allowing us to prove that our current cleaning process can provide a product that meets their cleanliness requirements using our current paste/wire/flux products. (This is just a pilot build f
Electronics Forum | Mon Mar 24 22:53:22 EDT 2008 | davef
As you say, just about defect can be tied to process, one way or another. If you want to think about it, search the fine SMTnet Archives for background on barrel cracking. Other things are: * How thick is the actual via plating from the two supplier
Electronics Forum | Wed Mar 26 09:19:20 EDT 2008 | nibirta
hi all...well i`m working in such a lab but we are working internally, and for our customers. But i can give you some prices from other labs. Cross section-one location is around: Solder Joint Integrity Std. sample plastic package $300.00 Shorts /
Electronics Forum | Mon Mar 24 14:19:36 EDT 2008 | burb1999
I have a DEK ELA and here is what happens. I print a board after going through the step and it is a dead on print. Then, with another print it will be off in Auto mode (sometimes up and sometimes down, seems to just be up and down not left to right
Electronics Forum | Wed Mar 26 09:26:12 EDT 2008 | lloyd
I know you said you checked your clamps but another look will do no harm. we had a very similar issue a while back, and it turned out that the plastic shim under the chase clamp magnet was damaged. This caused the chase clamps not to release properly
