Electronics Forum: after (Page 325 of 696)

Autoprogram for DOS

Electronics Forum | Mon May 21 12:23:08 EDT 2001 | davis_brinkley

Why would you want AutoProgram for DOS? AutoProgram ver 5.3.2 is avilable from Quad Systems and is supported for using Windows 3.1.1 This is the latest rev for AutoProgram it is not supported for other operating systems because there is no more resea

BGA rework profile help

Electronics Forum | Wed Jun 06 13:38:15 EDT 2001 | Michael Parker

To expand on Wolfgangs reply, I suggest you contact your local SRT rep. We recently had the same type of problem as yourself. This is the path we followed. Arrange for operator training, for yourself first, then the operators after you get the machi

Can local fiducials improve BGA placement?

Electronics Forum | Wed Jun 06 16:51:06 EDT 2001 | jax

Unless your placing micro-bga, board edge fiducials on alternating corners will provide more than enough placement correction ( Micro-bga's should also be fine depending on how your equipment maps the board ). The part data and vision recognition nee

Silver Emerge

Electronics Forum | Fri Jun 15 09:16:46 EDT 2001 | adam

Thanks Dave. About your second comment, the issue is placing BGA connectors mirror image (male, and female), the connector sometimes shifts during placement before reflow. we are using a six mil stencil for both sides with minimum paste deposit. a

Silver Emerge

Electronics Forum | Mon Jun 18 21:21:25 EDT 2001 | davef

Two things: 1 A flat surface will probably help the "balls on the socket sliding off the ridge of HASL" problem, but possibly consider less risky choices for your flat surfaces that immersion silver, like: OSP, ENIG, and immersion tin. 2 Don�t throw-

Mixed tech. wave defects - HELP

Electronics Forum | Mon Jun 25 11:26:36 EDT 2001 | wbu

What about conveyor speed? I tried to manage that the speed of the board and the speed of the wave were nearly the same at that point where the leads are leaving the wave. But actually I haven�t seen icycling except at one time and that was solved r

Paste In Hole

Electronics Forum | Mon Jul 09 14:03:39 EDT 2001 | ohboy

Make sure you're getting a good roll from your squeegies. Poly will "scoop", leaving less, nickel will add a little extra. A slightly shorter blade height out of the holders will help promote a good roll- this helps push the paste into the thru h

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu

Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as

Wicking-solder found under mask

Electronics Forum | Mon Jul 16 08:56:56 EDT 2001 | Hussman

Easy, DL says the customer is telling him after 5 reflow processes they get solder under the mask. He tried it and didn't see anything. DL needs more information to understand why and where this is occurring. So, if he can't duplicate the problem

0402 placement skew

Electronics Forum | Sat Jul 07 08:19:47 EDT 2001 | Stefan Witte

If your pads are raised as you mentioned, you will reach just the tip of your tiny glue dot, which may not hold the part in place. However, you should be using two glue dots on each side of your 0402 component. See under adherence force in paste a


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