Electronics Forum: soldering (Page 325 of 2099)

Re: Micro Vias in Pads

Electronics Forum | Tue Mar 24 11:20:18 EST 1998 | Earl Moon

| Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via? Typically, micro vias are drilled and plated to about .003" diameter. To avoid significant solder "drain off," they should be drilled as shallow

Re: SMT at home?!

Electronics Forum | Fri Jan 16 23:33:32 EST 1998 | Scott

| Is there any way to implement SMT at home? | I want to assemble a prototype board of mine. | How can I hand-solder a 208-pin 0.5 mm lead | pitch PQFP -- lead-by-lead (the usual way), | or side-by-side (partial heating method)? | Alas, no SMD rework

Solder ball specifications?

Electronics Forum | Mon Jan 28 16:12:47 EST 2002 | Joe B.

Dave F, thank you for your reply and the references you included. You asked why I'm trying to understand this info, here's an answer: I'm working on an NSF-funded materials-related project, one aspect of which may lead to some advances in the forma

Polarity for SMT Devices

Electronics Forum | Tue May 28 09:08:52 EDT 2002 | pjc

Silkscreening is falling out of favor, as it should. SMT IC devices can have their "pin one" solder lands indicated by a round mark, like a fiducial or a "1" mark, both made from either the copper clad PWB material or silkscreened. I have seen some w

Reflow PBGA

Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L

Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps

Question on Solder Paste

Electronics Forum | Mon Aug 26 20:35:08 EDT 2002 | davef

There are no industry standards for eutectic solder-paste in conjunction with the life span of solder-paste. Whatever that is. Speaking of that ['whatever that is.'], what do you mean by �life span of solder-paste�? Is that: * Shelf life? * Workin

Solder mask registration

Electronics Forum | Fri Sep 27 08:12:19 EDT 2002 | yngwie

Dear all, My customer is asking me to add chevron solder mask registration marks to their board design, drive fabrication capability study from their board vendor(s), and make sure tolerances are established correctly for copper traces and solder mas

Wave Soldering - Icicling/Bridges

Electronics Forum | Fri Jan 24 22:50:51 EST 2003 | MA/NY DDave

Hi Again Distance is tough, besides far less exciting.. You got the panther at your breast, screaming!! Somehow you have to make this go the other way. Rather than solder flowing any old place it wants to, when it wants to. Chasing the heat, Chasi

Wave Soldering - Icicling/Bridges

Electronics Forum | Tue Jan 28 16:27:43 EST 2003 | MikeF

I agree with most of the other suggestions here, but 90 C for a topside preheat temp seems low to me. I remember aiming for 98 to 104 C for topside temp just before hitting the solder. Boards that had large ground/power planes or a lot of layers I wo

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor

Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve


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