Industry News | 2018-12-21 15:12:38.0
The GL Spectis 1.0 Touch Flicker Spectrometer is ideal for categorizing flicker in luminaire design and test, in addition to full CIE photometric and radiometric parameter calculation, LED Binning, Pass/Fail testing, remote control and data transfer, etc.
Industry News | 2003-06-04 23:20:09.0
we supply FUJI feeder;tape guide 0.7/1.0/1.3;reel;spring...
Industry News | 2015-12-16 18:26:09.0
Pulse Electronics Corporation introduces an all-in-one combination antenna and proximity sensor package to optimize the characteristics of both functions, thus enabling better device performance and increased design flexibility for tablets, laptops, and notebook computers. The ProxAnt TL 1.0 is a seven band main antenna, a proximity sensor chip, and all needed components included on the same flexible circuit board. Without requiring physical contact, the sensor recognizes when it is close to the user and sends a signal to the host processor to reduce the transmission power to the antenna, thus lowering SAR. The sensor also recognizes movement to avoid a false trigger.
Industry News | 2008-05-03 17:15:32.0
PCI Express brought about a whole new series of challenges for designers and the next generation. PCI Express 2.0 takes the challenges to a new level. Doubling the speed of the link to 5 GT/s, while maintaining backwards compatibility with PCI Express 1.0 potentially opens up interoperability issues. This presentation describes the methods and tools required to validate PCI Express 2.0 designs.
Industry News | 2019-12-31 13:46:06.0
Siborg's LCR-Reader-MPA offers the highest basic accuracy and most features out of all their tweezer based multimeters. The Professional Task Kit is a pre-bundled device with additional accessories.
Industry News | 2019-06-28 14:40:30.0
Siborg Systems Inc. gave the first viewing of LCR-Reader-MPA for the first time in Korea from May 15- 17 2019
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2021-05-27 14:38:58.0
All-in-one multi-tester LCR-Reader-MPA placed third in their category for Plant Engineering's Product of the Year
