Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef
Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get
Electronics Forum | Tue Aug 29 06:00:47 EDT 2006 | bwet
Ladies and Gents: There have been several studies including (http://www.solder.net/PDFs/LeadFree_BGATesting_InitialCycling_BEST.pdf) which have shown lower fast pass yields with solder paste. Based on internal projects of 1000+ of the same BGAs we a
Electronics Forum | Wed Oct 31 04:37:15 EDT 2007 | aj
Hi, My oven has 5 zones each 12 inches in length , giving a total of 70 inches Heating Zone in total. I am working with a 6 layer PCB ,ENIG Finish. I am using Alpha OM338T no-clean Solder Paste. I am working to a cycle time of 4 to 4.5mins RTS p
Electronics Forum | Sat Aug 03 03:28:16 EDT 2019 | alexeyzb
We use SNPb for such applications (PCBA for aircraft). We tried SAC305 but recieve no good quality, so now only SNPb. If you will find good solution - please write. Because now we have some problems with BGA - no SNPb balls. And need to reball (addit
Electronics Forum | Fri Oct 19 17:09:56 EDT 2007 | hegemon
We have both DRS24 and DRS25 Lead Free rework is done for the most part on the DRS25, although the DRS24 can handle some of our smaller pbFree assemblies. We bought the DRS25 machine new, it was not an upgrade. The machine is very successful at pb
Electronics Forum | Mon Dec 15 18:22:36 EST 2014 | mcapizzi
As was stated, there are a number of variables that could come into play. I have used AirVac DRS26 and SRT Machines. We are now using Shuttle Star which has IR as well as hot air heat. This works much better for us. You can view these at. http://www.
Electronics Forum | Wed Jul 24 23:21:26 EDT 2002 | ppcbs
Being in the line of BGA rework and having performed much rework on boards that go into military planes, I can give you an opinion from a practical background rather than an in depth study. Basically BGA's have caused many of my customers big headac
Electronics Forum | Fri Apr 21 18:02:16 EDT 2006 | SD
You didn't explain exactly how you are reworking the BGA and at what point the pad comes off. Assuming it's from an iron... The biggest cause of lifted pads is too much heat. Whether it be the iron temp or the amount of time the iron is on the pad
Electronics Forum | Tue Feb 15 09:27:34 EST 2000 | Casey Scheu
Sal, This is a common problem experienced by several OEM's. It all comes down to heat. This is why the problem is corrected on your repair unit. I would suggest using a Slim Kic or Data Pac (mole) to thermal couple the IC prior to the reflow oven.
Electronics Forum | Thu Feb 03 20:45:28 EST 2000 | Gary
I have worked with the PDR type rework station on and off for 12 years and have found that the IR can offer a lot of advantages over hot air. As was mentioned the lack of nozzels is a great advantage. The back heater takes a while to warm up but on
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