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Surface Mount Epoxy 4089

Surface Mount Epoxy 4089

New Equipment | Dispensing

Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure, 

AIM Solder

Henkel Surface Mount Adhesives

Henkel Surface Mount Adhesives

New Equipment | Materials

As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app

Henkel Electronic Materials

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

TG-1000-24 Hotbar ACF Bonding or Soldering System with Motorized Rotary Table

New Equipment | Other

Toddco3 Hotbar Bonding or Soldering System is a modular, floor standing bonder with a precision servo-driven rotary table. Compact overhead controls system with touch-screen display for easy operator acess is standard. Standard system software provid

Toddco3

NH05 Writing Pen/ Dispensing Nozzle Tip

NH05 Writing Pen/ Dispensing Nozzle Tip

New Equipment | Dispensing

Dispensing nozzle tip also known as writing pen is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection. To e

Vimic Electronic Corporation

NH11-T Common Dispensing Nozzle Tip

NH11-T Common Dispensing Nozzle Tip

New Equipment | Dispensing

Common dispensing nozzle tip is used to dispense the glue to the die location with the compressed air in most of dispensing process, such as die bonding, electrical circuit connection, structural and circuit board connection. To ensure the glue flow

Vimic Electronic Corporation

NH01 Dispensing Nozzle Tip

NH01 Dispensing Nozzle Tip

New Equipment | Dispensing

Dispensing tools can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. In order to keep up with the rapid deve

Vimic Electronic Corporation

NH03 Precision Nozzle

NH03 Precision Nozzle

New Equipment | Dispensing

Precision nozzle can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. To ensure the glue flows smoothly, our

Vimic Electronic Corporation

NH09 Fluid Dispensing Nozzle

NH09 Fluid Dispensing Nozzle

New Equipment | Dispensing

Fluid dispensing nozzle can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. To ensure the glue flows smoothl

Vimic Electronic Corporation


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