Electronics Forum | Mon Dec 01 15:21:08 EST 2003 | davef
Hey, I thought you were in the BIG house on some trumped-up tax rap. We use many RF shields each month. Generally, the shields are not plated and made of alloy 770 (or alloy 752), half hard temper, as the base material. * Alloy 770; 55%Cu, 27%Zn,
Electronics Forum | Thu Jun 08 17:13:41 EDT 2006 | davef
We don't agree that "a little to the top would just even things out". The raw flux on the top of the board never touches the wave and so, does not receive the proper amount of heat for activation, except at the through hole barrels. * We assume WML
Electronics Forum | Mon Jun 18 21:46:27 EDT 2001 | davef
It's possible that combining these two fluxes is benign, you sure can't say your customer is wrong, can you???? So, what is the intent of leaving these two different flux materials on your board? What is the residue remaining on your board as your
Electronics Forum | Fri Aug 18 07:42:11 EDT 2006 | amol_kane
Hi Russ, Can you please clarify on what you mean by "after wash they should be gone since it is water soluble,".....the flux would be water soluble or otherwise, how does that relate to solder balls being removed by cleaning?...i can see them being r
Electronics Forum | Mon Apr 17 18:42:32 EDT 2000 | Russ
Murad, I have just completed a switch over in our facility to no-clean. We used Alpha 609 and 857 paste and wave flux respectively. We currently use Alpha UP78 paste, NR330 wave flux, NR205 liquid flux for touchup and cleanline 7000 wire solder as
Electronics Forum | Mon Jun 07 09:29:17 EDT 2004 | Rob
Depends on the manufacturer but I know with Kester they strictly tell you once paste dries out it can never be brought back to usefulness. Adding flux will alter the properties of the paste and may affect the final product.
Electronics Forum | Thu Dec 21 14:29:08 EST 2000 | CEFD
There must be a good reason for somebody to say that; I just can't think of one. We have a CRT and there is an issue with flux affecting the performance of the machine, but it is not terribly bad. Run your reflow profile the way it is supposed to run
Electronics Forum | Wed Jan 26 10:43:32 EST 2011 | grahamcooper22
From our experience with our gel fluxes the depth of the flux cavity can be 30% ~ 70% of the ball diameter. You'll probably need to do some tests to find the optimum for your process. If you have really fast movement on pick and placement machine the
Electronics Forum | Fri Aug 11 16:19:39 EDT 2006 | T. Oaks
Hi, We have a issue with current leakage between pins on an SSOP 28 in a low frequency RF application and there is a suspicion that it is being caused by something in the flux residue. We have had the bad boards analyzed and a 'high' Chloride level w
Electronics Forum | Tue May 26 16:35:53 EDT 1998 | Ryan Jennens
| | We recently made the switch to no-clean and the wurface mount is turning out beautifully. However, the wave solder process continues to put up a fight; we are getting a white residue on the surface of the PCB. The residue is not localized
