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EMC Automotive Component Testing Detailed in Free Wall Chart from Schaffner EMC

Industry News | 2003-06-25 12:28:40.0

The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.

SMTnet

CirTran Receives Joint U.S./Canadian Certification

Industry News | 2003-02-25 08:07:11.0

Announced that it received Certification Approval From the United States/Canada Joint Certification Office, Defense Logistics Information Service.

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CirTran Receives Order From U.S. Government Agency

Industry News | 2003-02-27 08:13:16.0

The order was placed through CirTran's wholly owned subsidiary, Racore Technology Corporation.

SMTnet

Teradyne Expands Presence in China and Opens Shanghai Facility

Industry News | 2003-03-12 09:10:10.0

As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.

SMTnet

DPAC Technologies Strengthens Board of Directors with New Independent Board Member

Industry News | 2003-04-28 07:47:37.0

DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board

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SEC Declares CirTran Registration Statement Effective

Industry News | 2003-06-06 08:08:03.0

Company Further Strengthens Financial Position With $5 Million Equity Credit Line

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Rogers� Q4 Sales Up 7%

Industry News | 2003-02-13 07:53:53.0

Belgian Laminate Plant Set to Come Online

SMTnet

Deep Micro-vias Available on Large-format PCBs

Industry News | 2003-02-25 08:18:29.0

Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.

SMTnet

DDi Corp. Appoints New CFO, Sr. VP

Industry News | 2003-03-07 08:52:29.0

Announced the appointment of John Stumpf as chief financial officer

SMTnet

Nippon Mining Holdings to Increase Production Capacity for Rolled Copper Foil

Industry News | 2003-03-12 09:03:48.0

Demand for the material, used in PCBs, is increasing because of folding mobile phones and other devices

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