Full Site - : high density packaging (Page 4 of 3134)

Circuit World 'continues to outperform majority of printed circuit industry'

Industry News | 2003-02-25 09:31:32.0

Toronto-based Circuit World Corporation (CCW) today announced its fourth quarter and audited year-end results to December 31, 2002.

SMTnet

Niche Electronics Technologies & QCMS Partner with MIRTEC to Meet High-Quality Manufacturing Standards!

Industry News | 2020-10-19 14:25:19.0

MIRTEC is pleased to announce that Niche Electronics & QCMS have selected MIRTEC's MV-6 OMNI 3D AOI machine to meet their ongoing commitment to flawless manufacturing quality. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable both facilities to achieve 100% customer satisfaction.

MIRTEC Corp

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

SMTnet

NEMI Premieres Latest Roadmap at APEX 2003

Industry News | 2003-02-06 08:28:24.0

Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2

SMTnet

Teradyne Expands Presence in China and Opens Shanghai Facility

Industry News | 2003-03-12 09:10:10.0

As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.

SMTnet

DPAC Technologies Strengthens Board of Directors with New Independent Board Member

Industry News | 2003-04-28 07:47:37.0

DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board

SMTnet

VEXOS Selects MIRTEC as 3D AOI 'Partner of Choice'

Industry News | 2021-01-17 17:28:43.0

MIRTEC is pleased to announce that VEXOS has selected MIRTEC as their 3D AOI 'Partner of Choice' based on key performance indicators including Inspection Performance, Gage R$&R, Ease of Programming and Customer Support.

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2020

Industry News | 2020-01-06 16:06:59.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.

MIRTEC Corp

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

SMTnet


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