Electronics Forum | Sat Jun 10 07:27:24 EDT 2006 | davef
Chuckie: SM4007A Diode case is D0-214AC G. Eisner: On tombstoning: * Check reflow profile * Pads per IPC-SM-782 * Reduce amount of solder paste * Check component solderability * Place component accurately * Search the fine SMTnet Archives for backgr
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
Electronics Forum | Wed Sep 06 05:55:15 EDT 2000 | randy
Our R&D uses Land Pattern Design based on Manufacturer's recommendation and not IPC Standard Land Pattern design. I suggested to shift to IPC but he just ignored me and laughed about it. We are encountering hips of wrong land pattern design since we
Electronics Forum | Wed Mar 29 02:42:21 EST 2000 | Wolfgang Busko
Michael: "C1005" stands for Capacitor 0402. For the package 0603 you need to choose "C1608". This is out of IPC-SM-782. I don�t know where it�s coming from we also deal with 0603 or 0805. IPC uses RLP-numbers (Registered Land Pattern Number) to ident
Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink
We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance
Electronics Forum | Wed Jun 20 12:07:13 EDT 2001 | Steve
I would suggest getting a copy of IPC-SM-782A, Surface Mount Design and Land Pattern Standard, and IPC-7525 Stencil Design Guidelines. My experience is that reflow does not cause tombstoning very often. Pad and land design, paste volume, and placemen
Electronics Forum | Wed Dec 01 10:14:41 EST 1999 | Wolfgang Busko
Hi Steve, the "framepiece" I mentioned may be misunderstanding but sometimes I don�t know the common english expression. What I meant is if the PCBs do not come in panels (now you mentioned 3-up panel)the PCB supplier could add additional material to
Electronics Forum | Wed Jun 23 18:23:32 EDT 1999 | Tom B.
Even though you may find a pad-pad thru-hole spacing, part body size, orientation, and insertion head tooling clearences may be the deciding factor in spacing. 1. Part body diameter will dictate component centroid spacing. ---[][][][
Electronics Forum | Tue Apr 06 16:09:25 EDT 1999 | Dave F
| Hi, | Somebody know how to calculate the size of pads for different IC's: QFP's, SOIC, SOJ, etc. | | any help is apreciated. | | thanks | | AC | Al: Justin's comments are well taken. Who should know better about pad sizes that the component m
Electronics Forum | Thu Apr 09 00:07:54 EDT 1998 | Bonnie
I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have no
