Industry News: lambda die bonder (Page 4 of 6)

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the MVP 850G AOI at Productronica 2013

Industry News | 2013-11-06 14:17:59.0

Machine Vision Products will be demonstrating its 850G inspection solutions on Booth 220 in Hall A2 at the Productronica 2013 exhibition.

Machine Vision Products, Inc

Saline Lectronics Announces New In-house Wire Bonding Capability

Industry News | 2015-08-11 09:37:25.0

Saline Lectronics now offers wire bonding in-house as an added-value service. With the installation of the Kulicke & Soffa 4500 Manual Wedge Bonder, Saline Lectronics is now one of the only electronic contract manufacturers in the Midwest to support wire bonding services. 

Saline Lectronics, Inc

Fluxless soldering using formic acid vapor for optoelectronics

Industry News | 2023-11-20 15:33:13.0

Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several innovations in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.

Tresky AG

Tresky presents metallic sintering for power electronics at productronica 2023

Industry News | 2023-10-30 19:21:14.0

Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.

Tresky AG

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the MVP 850G platform AOI at Semicon West 2014

Industry News | 2014-07-03 17:48:53.0

Carlsbad, CA– July 3, 2014: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the MVP 850G Microelectronics and Packaging AOI platform at the Semicon West 2014 exhibition. The exhibition is at the Moscone Center in San Francisco from July 8-10 2014. Machine Vision Products are exhibiting at booth #6367 in the North Hall.

Machine Vision Products, Inc

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech

Finetech Unveils High Force ACF Bonder

Industry News | 2013-11-08 18:07:48.0

Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.

Finetech

GKG Asia Announces a Successful productronica Exhibition in Germany

Industry News | 2013-11-20 16:52:27.0

GKG Asia Pte Ltd announces that it participated in the recent productronica exhibition that took place November 12-15, 2013 in Munich, Germany and reports that the show was a complete success.

GKG Asia Pte Ltd

Hanwha Techwin Enters 45th Year as a Global Provider of Smart SMT Line Solutions

Industry News | 2022-01-10 16:44:56.0

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, is pleased to announce its 45-year anniversary. The company started in the machine tool business in 1977. Now, 45 years later, Hanwha is stronger than ever and has a global reputation for being a fair partner who focuses on quality and service, placing customers first.

Hanwha Techwin CO., LTD.

Machine Vision Products to Demonstrate Diverse Microelectronics and Packaging Inspection Toolbox of its MVP 850 AOI Platform for at Semicon West 2015

Industry News | 2015-07-10 13:55:54.0

Carlsbad, CA – July 10, 2015: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the MVP 850 Platform for Microelectronics and Packaging AOI platform at the Semicon West 2015 exhibition. The exhibition is at the Moscone Center in San Francisco from July 14-16 2015. Machine Vision Products are exhibiting at booth #6254 in the North Hall.

Machine Vision Products, Inc


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