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SHENMAO to exhibit new pastes at SMTAI SHENMAO pastes reduce peak reflow temperature, energy consumption, and warpage of PCBs and components

Industry News | 2018-09-18 20:19:23.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.

Shenmao Technology Inc.

underfilling of bga

Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi

1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type

Lead free rework of BGA

Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39

When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.

First documented case of tin whisker formation

Electronics Forum | Fri May 12 11:12:20 EDT 2006 | patrickbruneel

Slain, A melting point of 300C would be a little too high for the components and tinny boards. I just heard they will market the watches as Swiss "army" watches which makes them exempt.

Re: Parylene Coating of Plastic Parts

Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian

Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to

Reflow soldering of lead-free components with leaded solder paste

Electronics Forum | Fri Feb 23 09:35:36 EST 2024 | emanuel

We have the standard profile as a template made according to the solder paste specs. For some boards we measure the result at 2 points, on the board itself and on top of a sensitive SOT263 module and adjust accordingly. The solder paste is well kept,

High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag

Electronics Forum | Mon Aug 25 02:57:43 EDT 2014 | arjunkolavara

We are in the process of qualifying our SMT lines for the High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag.If any one has already an experience with this alloy,kindly do give ur inputs on the process of profiling . The reflow d

High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag

Electronics Forum | Mon Aug 25 08:15:54 EDT 2014 | jax

With a melting point of roughly 300°C, you would need to have the product see temperatures peaking around 325°C at a minimum. (I would make sure the components and PCB materials can withstand these temperatures) Most convection ovens do not go over 3

High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag

Electronics Forum | Mon Aug 25 12:43:35 EDT 2014 | freddimock

Numerous people use the Pyramax oven to process high temp solder but your success will depend upon the mass of your board. To maximize the probability of success you should use the highest convection rate (IWC) possible to enhance heat transfer an

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