Industry News: mydata and measuring and base and level (Page 4 of 13)

Mentor Graphics Announces New HyperLynx Technology with Advanced 3D Channel and Trace Modeling, Superior Accuracy and Fastest Simulation Performance

Industry News | 2013-02-01 15:00:00.0

Mentor Graphics announced the newest release of its market-leading HyperLynx® product for superior high-speed design and analysis. Key features in the new HyperLynx product release include advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance—up to 5X faster.

Mentor Graphics

ASSET aligns company, technology and products with embedded instrumentation

Industry News | 2008-05-15 23:05:35.0

RICHARDSON, Texas (May 14, 2008) - Responding to the increasing momentum in the electronics industry toward embedded instrumentation, ASSETR InterTech, Inc. (www.asset-intertech.com) announced it is positioning the company, its products and its technologies to provide open tools for embedded instrumentation in design validation, test and debug applications.

ASSET InterTech, Inc.

YXLON International Presents New Release of Cheetah and Cougar EVO

Industry News | 2021-03-23 08:23:59.0

YXLON International presented the new release of the Cheetah and Cougar EVO microfocus X-ray families in three online events. Under the motto 'Innovation is key to Evolution - Evolution empowers you', the next step towards automation was demonstrated and new options were presented that significantly increase efficiency in the X-ray inspection of electronic components.

YXLON International

Koh Young Officially Qualified in the New IPC CFX Validation and Certification Program

Industry News | 2021-02-08 11:04:33.0

Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, has taken its CFX support to the next level by endorsing the IPC CFX Validation and Certification Program. As an Early Adaptor of this new IPC program, Koh Young has officially validated and certified its KY8030 Solder Paste Inspection (SPI) Series and Zenith Automated Optical Inspection (AOI) Series as CFX-compliant.

Koh Young America, Inc.

CyberOptics Awarded Two NPI Awards for SQ3000™ CMM and CyberCMM™ Software

Industry News | 2020-02-06 06:49:31.0

Garners the 18th Industry Award for MRS™-Enabled Systems and Sensors

CyberOptics Corporation

Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX

Industry News | 2016-02-17 16:31:00.0

Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos

Industry News | 2016-02-18 19:59:51.0

Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Saki Demonstrates XL 3D AOI System and On-the-Fly Debugging Software at SMTA International Booth 726

Industry News | 2016-09-22 18:12:16.0

Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.

SAKI America

Faster assembly of complex products - new lines and equipment investment by Assel

Industry News | 2017-03-28 07:31:46.0

Faster assembly of complex products - new SMT lines and equipment investment by Assel, Poland based Contract Manufacturing Services provider.

Assel

Koh Young Officially Certifies its Inspection Systems in theNew IPC CFX Validation and Certification Program

Industry News | 2021-02-12 16:35:42.0

Koh Young has taken its CFX supportto the next level by endorsing the IPC CFX Validation and Certification Program. As an Early Adaptor of this new IPC program,Koh Young has officially validated and certified its KY8030 Solder Paste Inspection (SPI) Series and Zenith Automated OpticalInspection (AOI) Series as CFX-compliant.

Koh Young America, Inc.


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