Industry News | 2023-06-28 08:02:56.0
European Commission Selected KDPOF along with Three Spanish Companies Getting Access to the 8.1 billion Euro Investment IPCEI for Chip Development
Industry News | 2011-08-18 15:07:13.0
Data I/O Corporation will highlight the new RoadRunner3 inline programming system at the upcoming SMTA Capital Expo & Tech Forum.
Industry News | 2012-01-23 14:42:20.0
Data I/O Corporation will showcase the new RoadRunner3 inline programming system, the next generation of the world’s only just-prior-to-placement programming solution in Booth #3744 at the upcoming IPC APEX Expo.
Industry News | 2012-03-07 16:28:28.0
Data I/O Corporation has been awarded a 2012 NPI Award in the category of Device Programming for its RoadRunner3 inline programming system.
Industry News | 2017-09-13 14:19:50.0
Hover-Davis will be exhibiting its latest feeder and identification solutions in Universal Instruments’ booth # 223 at SMTA International Electronics Exhibition on September 19-20 at the Donald Stephens Convention Center in Rosemont, Illinois near Chicago.
Industry News | 2017-09-20 15:08:48.0
Viscom AG today announced the adoption of the Valor® Process Preparation technology from Mentor, a Siemens business, for its Viscom vVision SPI and AOI systems. Recognized globally for providing superior 3D optical and X-ray inspection systems for electronics manufacturing, Viscom is seeing important benefits in using this additional tool. When combined with Valor Process Preparation software, the efficiency of the machines is significantly enhanced.
Industry News | 2019-01-17 17:06:16.0
Hover-Davis, the global leader in the design and manufacture of electronic component and media delivery solutions, will celebrate its 30 year anniversary at IPC APEX Expo in San Diego, CA on January 29-31 where it will display its latest feeder and material automation solutions.
Industry News | 2018-05-20 19:50:08.0
SMT Hybrid Packaging 2018 – Hall 4A, Stand 122 – Whether it’s the Connected Factory Exchange (CFX) Showcase in cooperation with the IPC, or the training of a collaborative robot, who then autonomously handles manual x-ray inspection, visitors to the Viscom stand (4A, 122) at SMT Hybrid Packaging will gain insight into newest ideas of the industry being put into action. The show will take place June 5-7 at the Messe in Nuremberg, Germany. As an inspection solution with high future potential, Viscom will be exhibiting its new X7056-II system: an award-winning combination of extremely fast inline X-ray inspection (3D AXI) and automatic optical inspection (3D AOI). Another future-oriented Viscom topic at the trade show will be artificial intelligence (AI).
Industry News | 2010-05-11 14:43:51.0
Saint-Egrève, France - Vi TECHNOLOGY is pleased to be hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrates its 5K Series at SMT/HYBRID/PACKAGING 2010. More VIT equipment will also be presented at our agent’s booth 7-219, SmartTech to demonstrate solutions reducing defective PCBAs.
Industry News | 2019-02-15 05:28:59.0
STMicroelectronics announced the integration of machine learning technology into its advanced inertial sensors to improve the motion tracking performance and battery life of mobile phones and wearables.
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