Electronics Forum | Wed Aug 01 17:17:15 EDT 2001 | mparker
Since you are restricting the outward flow of injected material to basically mimic the package dimensions that would force you to design some sort of coffer dam beneath the part to contain the injected material. One alternative to your quest could b
Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef
We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead
Electronics Forum | Tue Apr 23 15:36:27 EDT 2019 | davef
Josh, are you setting someone up with these questions? Answers to your questions related to the subject line follow: Q1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask?
Electronics Forum | Wed Dec 10 21:30:59 EST 2008 | davef
We've never involved ourselves in this specific type of effort, but in the past, when removing conformal coat material the supplier of the conformal coat mat material was by-far the most knowledgeable about proven techniques for removing their materi
Electronics Forum | Fri Jan 11 17:14:13 EST 2002 | davef
We have one product with electroless nickel, immersion silver solderability protection. We do not purport to be experts, but like many things, have seemingly boundless opinions. Side note: There are a least three different [maybe five] imm silver
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
Electronics Forum | Tue Sep 16 23:58:03 EDT 2003 | iman
interesting! I recently invested a small personal fortune into books nad other related literature to boost my understanding the scientific properties of materials used in electronics and interconnection packages. One area( one of many areas) of p
Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund
We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S
Electronics Forum | Tue Dec 19 21:48:05 EST 2000 | Charles Harper
Yes,we have over two dozen courses covering all ranges of interests from fundamentals to all of the advanced high performance electronic packaging and circuit technologies.We provide these courses to a broad range of industry,government and educatio
Electronics Forum | Wed Dec 27 21:12:30 EST 2000 | Dave F
From a process perspective, I don�t know if you should be concerned ... You've told us nothing about your process. THE BOOK JEDEC MO-51 allows 6 thou warp in smaller [1mm pitch] BGA and 8 thou in larger [ 1.27mm and 1.5mm pitch] BGA. The increase
