Electronics Forum: paste volume (Page 4 of 88)

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 17:12:38 EST 1999 | Dave F

Steve: Addressing your points: 1 FINE PITCH APERTURES Electropolishing Laser Cut Stencils: Laser cut should not requiring polishing. Geesh, how much money do you have for stencils? ;-) Oval Shaped Apertures: Pass. What do you expect to gain f

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F

Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�

Re: paste release from stencil, and volume calculation

Electronics Forum | Sat Nov 13 14:09:45 EST 1999 | se

First, let me say what I always say: a good chem-etched stencil will print fine pitch. Chem-etch brings trap to the side walls because its a physical by-product of the process. Because they are less expensive you can add electropolish and still save

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:13:41 EST 1999 | Dave F

Steve: There are guidelines for determining if your aperture has the correct proportions to the foil thickness. Maybe that�s what you�re looking for: 1 Aspect ratio = aperture width/foil thickness Chemically etched SB GT 1.5 Laser cut SB GT 1.2

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 19:45:48 EST 1999 | Steve Thomas

1 Money IS an object, and my boss will be thrilled. The stencil manufacturer recommended ovals to facilitate better release. Seems likely to be true, but whether or not it's necessary I don't know. We have perpendicular walls on these (6 mil) ste

low volume /semi-automatic solutions

Electronics Forum | Wed Jun 18 16:03:03 EDT 2003 | mkehoe

Orrrrr, just buy a small reflow oven, 5K to 7K, and eliminate the paste printing by using solid solder deposition. No shorts, no opens, no cleaning, and no voids. www.sipad.com If you decide to print your own paste later you can invest the extra 30

low volume /semi-automatic solutions

Electronics Forum | Tue Jun 17 16:10:01 EDT 2003 | russ

First, what would you define as semi-automatic? For SMT production you might need a screen printer (these can be anything from full manual to full auto. The low end printers manual require each board to be aligned with a piece of mylar prior to p

low volume /semi-automatic solutions

Electronics Forum | Wed Jun 18 10:07:02 EDT 2003 | caldon

There are a few directions to go from Here... 1) Outsource it to a CM, 2) Capital investment both have there issues. To Out source I would have processes in place to Inspect quality, resolve issues, Assure quaility, and Hope they can meet your deadli

Solder Paste volume w/reliability data.

Electronics Forum | Tue Jul 27 13:01:06 EDT 1999 | Mike Laroe

Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly appre

Re: Solder Paste volume w/reliability data.

Electronics Forum | Fri Jul 30 15:41:16 EDT 1999 | M.L

| | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly a


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