Electronics Forum: pb36 (Page 4 of 6)

Soldering Temperature for TQFP160

Electronics Forum | Tue Jan 20 06:46:39 EST 1998 | IgmarG

This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Qu

Re: Soldering Temperature for TQFP160

Electronics Forum | Thu Jan 29 08:33:34 EST 1998 | Mike Moninger

| This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. | Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thi

Re: Soldering Temperature for TQFP160

Electronics Forum | Wed Jan 21 22:35:01 EST 1998 | Scott

| Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this c

SnPbAg solder paste at reflow oven

Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip

It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.

solder paste(SnPbAg)

Electronics Forum | Wed Aug 06 14:49:06 EDT 2014 | dyoungquist

Sn62Pb36Ag2 has a higher liquidus point of 189C as compared to Sn63Pb37 at 183C. You may need to slightly adjust your oven profiles to use it compared to SnPb. We have had good solder-ability and reliability with it in our IPC Class II products. A

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:57:14 EDT 1999 | JohnW

| | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | Leaching. Dissolution of a metal coating into liqu

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F

| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating

Strange problem with my dispenser

Electronics Forum | Tue Aug 10 15:56:30 EDT 1999 | Jason Gregory

Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation i

Re: 2% silver solder paste

Electronics Forum | Tue Apr 13 09:11:54 EDT 1999 | Dave F

| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to

Re: 2% silver solder paste

Electronics Forum | Tue Apr 13 17:44:29 EDT 1999 | Christopher Lampron

| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to


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