Electronics Forum | Fri Feb 02 11:24:13 EST 2007 | vze3nk2r
is there a level above 100,000 that does not require the use of booties for general assembly work?
Electronics Forum | Tue Jan 23 10:15:44 EST 2007 | slthomas
J-STD-001C just requires that the area not be so dirty as to contaminate your product, tools, workspace, etc. If you start counting particles, you're into cleanroom territory. Do a search on ISO 14644-1 for specifics. Actually Wikipedia does a ni
Electronics Forum | Tue Apr 19 09:09:28 EDT 2005 | russ
Here is one reason- It eliminates the viscosity change during printing operation from the paste warming up and getting thinner. I would contact your paste supplier and have them give you the full list.
Electronics Forum | Wed Apr 20 11:08:05 EDT 2005 | py
usual solder cream has a viscosity above 800 000pas at 25�C for each 1�C the viscosity change about 30 000 pas at 15�C you will have nothing ( 37% of viscosity less)on your board...
Electronics Forum | Mon Apr 25 07:31:35 EDT 2005 | jdengler
As Steve said do not re-refrigerate. You can also take the paste out early. We remove enough paste from the refrigerator for a full days work around noon the day before we use it. Jerry
Electronics Forum | Wed Apr 27 22:36:47 EDT 2005 | devilhitam
is there any relation between solder paste viscosity and the length of time the solder paste being used in the machine? pls advice....
Electronics Forum | Fri Apr 29 19:57:53 EDT 2005 | DasonC
Moisture will condensed on your paste if the temperature different. Solder bead will happen. You can see the jar or cartridge wet when you removed your paste from refrigerator.
Electronics Forum | Wed Feb 07 07:58:58 EST 2007 | ayelet
Thank you guys. So to summarize - no spec, just need to have decent cleaning... Are you familiar with dust events that caused burning of test stations ? Thanks Ayelet
Electronics Forum | Tue Apr 19 09:35:16 EDT 2005 | davef
You should follow your solder paste supplier recommendations. Examples are: * http://www.aimsolder.com/techarticles/tech%20sheet%20paste%20handling.pdf * http://www.efdsolder.com/PDF/ EFD_-_Frequenty_Asked_Questions.pdf * http://www.ncsmq230.indiu
Electronics Forum | Wed Apr 27 15:14:12 EDT 2005 | andymackie
The viscosity decrease on warming is one of the main reasons, but you also don't want to get moisture condensing on the surface of the paste. Activators in the paste (that are used to eliminate solderballs and enhance solderability on reflow) become
