Electronics Forum: test and interface and boards (Page 4 of 12)

ICT and specifying PCBA testing

Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef

Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input

assembly cleanliness and ionic testing

Electronics Forum | Sat Feb 14 08:21:13 EST 2009 | davef

We believe that it's perfectly resonable for you to define the cleanliness that you require. We recommend that you leave it at that and not define the process or materials that your supplier use in meeting that cleanliness level. Start with a dirty

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh

Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr

Solder beads and wave soldering

Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds

Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.

Re: Silver Epoxy and CEM3

Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson

| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic

Wave Cassettes and Heat convection

Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef

Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b

J-STD-002 and -003 solderability testing...

Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef

Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu

Pick and Place Machine Validation

Electronics Forum | Thu Mar 10 23:26:46 EST 2005 | timekey

Of course a new machine out of the box should perform at a realistic Sigma level and it's not unfair to hold a machine manufacturer true to their claims. However, even if a new machine does meet the criteria on day 1, the numbers will be constantly c

Re: BGA and Gold Boards

Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, Your concer

Via holes and Wave Solder

Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy

Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th


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