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Fuji AA0CC06 Roller BKT

FUJI S3138T SWITCH PHOTO PZ2 FUJI S3139A SWITCH PHOTO EX4 FUJI S3141B SWITCH PHOTO DL- FUJI S3141E SWITCH PHOTO FTV7 FUJI S3141S SWITCH PHOTO UM-T FUJI S3141W SWITCH PHOTO UM- FUJI S3141Y SWITCH PHOTO UM-Z FUJI S3

KingFei SMT Tech

The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat

ACI Technologies, Inc.

IPC Honors Best Papers at IPC APEX EXPO� 2009

Industry News | 2009-04-15 23:01:13.0

BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

Share Your Research at SMTA International 2016!

Industry News | 2015-11-25 16:58:05.0

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.

Surface Mount Technology Association (SMTA)

Micro-Sectioning of PCBs for Failure Analysis

Technical Library | 2010-01-13 12:34:10.0

Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.

BEST Inc.