Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Mon Nov 12 13:04:35 EST 2001 | slthomas
We've got a problem with a fine pitch board that has about .005" registration error at each end (towards the center of the board) when it's printed. Apparently we've got a case of board stretch generated at the fab shop. I still have to do some mea
Electronics Forum | Wed Jun 04 06:37:10 EDT 2003 | cdowny
I am looking into pick and place for medium to medium-high production with semi frequent changeovers. I have been looking for a little while and nosed around at APEX also. I am not interested in any used products, I have been down that road before
Electronics Forum | Tue Jan 16 07:07:17 EST 2007 | tk380514
Answers: The component does take solder, no problem We get a full barrel fill with an empty PCB but only on one of the holes, the other hole has so much copper around it. The flux reached the top of the PCB when I tested the empty PCB. The IPC-A-610
Electronics Forum | Mon Feb 05 10:12:32 EST 2007 | slthomas
The use of booties isn't required per se, just considered a standard step necessary to reach the 10,000 target. You also need to vacuum (central vac system, NOT exhausting into the room) daily, mop weekly, have a one piece floor, blah, blah, blah....
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
Electronics Forum | Fri Jul 23 23:47:03 EDT 1999 | Scott McKee
| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
